Friday, March 16, 2018

MEMSDrive OIS Technology Presentation

MEMSDrive kindly sent me a presentation on its OIS technology:


  1. How will the flex cable rigitity of the sensor be overcome?

    1. From memory, it depends on a dedicated substrate that handles both he interconnect to the moving sensor, and the mechanical translation form the MEMs. It's quite a nice system, but there are many hurdles to adoption, some small, some not so small.

    2. Signal from CMOS Sensor to PCB is going through MEMS moving structure. The wire bonding from sensor to MEMS and MEMS to PCB is fixed. So there is no concerning about wire bonding rigitity from CMOS sensor to MEMS and MEMS to PCB.


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