"We expect 12-inch wafer demand to grow from 3.3 million units in 2017 to 7.5 million in 2023, mainly fueled by Backside Illumination CMOS Image Sensors (BSI CIS) (3D stacked BSI, 3D hybrid BSI)."
Saturday, March 31, 2018
Yole on CIS Wafer Starts
Yole Developpement report "Wafer Starts for More Than Moore Applications" shows that CIS consumes more wafers than RF devices and MEMS, but less than power management devices:
"We expect 12-inch wafer demand to grow from 3.3 million units in 2017 to 7.5 million in 2023, mainly fueled by Backside Illumination CMOS Image Sensors (BSI CIS) (3D stacked BSI, 3D hybrid BSI)."
"We expect 12-inch wafer demand to grow from 3.3 million units in 2017 to 7.5 million in 2023, mainly fueled by Backside Illumination CMOS Image Sensors (BSI CIS) (3D stacked BSI, 3D hybrid BSI)."
Subscribe to:
Post Comments (Atom)
No comments:
Post a Comment
All comments are moderated to avoid spam and personal attacks.