Wednesday, July 10, 2019

Digitimes: 3D Sensing Market Surge Expected

Digitimes article "Taiwan chipmakers gearing up for 3D sensor market boom" quotes foundries Win Semiconductors and Advanced Wireless Semiconductor (AWSC), epitaxial wafer supplier Visual Photonics Epitaxy (VPEC), Himax, and backend houses ChipMOS Technologies, Xintec, and ShunSin Technology expecting imminent rise in 3D sensing orders for smartphones and ADAS.

Win Semi sees orders for ToF components ramping up from Apple suppliers and also non-Apple customers. VPEC provides epi-wafers for Samsung ToF VCSELs as well as being a major epi-wafer source for Win Semi. AWSC sees increased orders form Ams. ChipMOS gets 3D sensing orders from Himax, ShunSin gets 3D orders from its parent company Foxconn.

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