Programmable readout pixel

In a paper titled "A Programmable Readout Pixel Image Sensor" Lazzaro et al. from Dartmouth write:

In this paper, a pixel architecture that can be re-programmed to favor low noise, high speed, high dynamic range, or other characteristics desired in scientific imaging is proposed. Termed a programmable readout (PRO) pixel, this novel design combines a pinned photodiode, a deep-buried-channel CCD router, and multiple in-pixel amplifiers of different characteristics. By clocking the CCD router with different sequences, photogenerated charge can be steered to an appropriate readout amplifier given the application. The CCD router can be further programmed to store charge from multiple frames. The concept of such a pixel and its operation are described in detail and TCAD simulations aid in this discussion. To demonstrate this concept of programmability, a test chip is made with a CCD router and two in-pixel amplifiers: a floating diffusion amplifier (FDA) for fast readout and high-illumination imaging and a floating gate amplifier (FGA) for a low-noise Skipper-in-CMOS readout for low-light imaging. The test chip contains a 36 × 94 array of 20 µm pixels and contains 9 different pixel variants for experimental analysis. At the end of the paper, preliminary images captured from the different amplifiers are presented which demonstrate the ability to move charge to the selected readout while showcasing the different output characteristics of the two readout amplifiers. Furthermore, the output image from the Skipper-in-CMOS is compared across different numbers of non-destructive samples to demonstrate its noise-reduction capability.

Open access link: https://www.mdpi.com/1424-8220/26/16/5245

Figure 1. (a) PRO pixel concept with an adjacent PPD. (b) PRO pixel concept with a centered PPD. Both designs allow for readout by four different amplifiers of different characteristics.

 

 Figure 2. Test chip 20 × 20 μm PRO pixel showing simplified plan-view layout.

 Figure 11. (a) Test image captured using a 100 ns exposure time and the floating diffusion amplifier. (b) Test image captured using a 500 µs exposure time and the floating diffusion amplifier. (c) Test image captured using a 100 ns exposure time and the floating gate amplifier. (d) Test image captured using a 500 µs exposure time and the floating gate amplifier. It is noted that the horizontal bands are due to different pixel designs on those rows. 

Eric Fossum IEEE Jun-ichi Nishizawa medal announcement video

The IEEE Jun-ichi Nishizawa Medal was presented to Eric R. Fossum at the 2026 IEEE Honors Ceremony for the invention, development, and commercialization of the CMOS image sensor. 

The ceremony was held on 24 April 2026 in New York City.

The IEEE Jun-ichi Nishizawa Medal is given for outstanding contributions to material and device science and technology, including practical application.

ST announces a 1.1MP automotive CIS

STMicroelectronics introduces automotive image sensor to help scale affordable in-cabin sensing  

Helps OEMs and Tier 1s bring driver and occupant monitoring to high-volume vehicle platforms with lower system cost 

Delivers 35% higher image sharpness and nearly 60% higher infrared sensitivity than the previous generation in a compact 1.1 MP automotive image sensor 

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces ST SafeSense VD56GA, a new 1.1 MP automotive image sensor for infrared in-cabin sensing that helps OEMs and Tier 1 suppliers scale driver and occupant monitoring across vehicle lines while balancing performance, integration, and cost. 

As driver and occupant monitoring moves into more vehicle platforms, automotive manufacturers and suppliers are looking for imaging solutions that support strong in-cabin performance without adding unnecessary system cost or design complexity. VD56GA meets that need with a compact sensor architecture, high infrared sensitivity, and embedded image-processing features that can help simplify camera design and integration. The sensor is designed to give camera developers the image quality needed for driver and occupant monitoring while preserving the size and cost advantages of a compact format. In many in-cabin use cases, this can help customers meet performance targets without moving to a larger, more expensive sensor. 

“In-cabin sensing is moving beyond premium platforms, and carmakers need cost-effective solutions they can deploy broadly,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “With VD56GA, we focused on the system-level tradeoffs that matter most: image quality in infrared conditions, compact integration, and a cost structure that supports high-volume programs. Equally important, the sensor benefits from ST’s Integrated Device Manufacturer model, with front-end manufacturing in Crolles, France, giving customers greater supply-chain resilience, quality control, and long-term support for automotive programs.” 

“As driver and occupant monitoring systems move into a broader range of vehicle platforms, OEMs are increasingly focused on solutions that can be deployed at scale, with volumes set to exceed 70 million units by 2031. Success in this market depends not only on imaging performance, but also on reducing system cost, simplifying integration, and enabling adoption across high-volume vehicle programs," (*) underlined Anas Chalak, Market & Technology Analyst, Imaging at Yole Group.  

Helping carmakers scale driver and occupant monitoring 

VD56GA is designed to help reduce the cost of the complete camera module. Its imaging performance enables the use of lower-cost optics, simplified infrared illumination, less demanding optical filtering, and no external image-processing. For OEMs and Tier 1s, that can translate into a more cost-effective path to deploying driver and occupant monitoring across a broader range of vehicle programs. 

The sensor leverages a new backside-illuminated pixel architecture, called ST DeepNIR, optimized for infrared imaging. With 35% higher modulation transfer function (MTF) sharpness and nearly 60% higher quantum efficiency than the previous generation, VD56GA is currently the only sensor in its class to achieve this level of combined optical resolution and infrared sensitivity, helping in challenging conditions like under display camera. 

By extracting more performance from a compact 1.1 MP architecture, VD56GA helps automotive designers achieve the image quality required for advanced sensing functions, while benefiting from the integration and cost advantages of a compact sensor architecture.  

Compact integration with embedded image processing 

Designed for modern automotive camera modules, VD56GA is housed in a compact 3.7 mm x 3.2 mm CSP package, making it suitable for space-constrained installations and next-generation in-cabin camera designs. 

The device also integrates a range of embedded image-processing functions, including mirror, crop, dark calibration, auto exposure, and piecewise-linear processing. These features remove the need for external image-processing resources, simplify camera design and speed development. 

Support for both RAW and YUV output formats give OEMs and Tier 1 suppliers flexibility across different electronic architectures and software environments, making it easier to adapt the device to a broad range of implementation strategies. 

Building on ST’s automotive imaging leadership 

VD56GA builds on ST’s established presence in automotive imaging and in-cabin sensing. Earlier this year, ST announced shipment of its 10 millionth automotive of SafeSense by ST image sensors, reflecting broad adoption across key automotive regions, including Europe, Asia, and the United States.  

Customers benefit from ST’s vertically integrated manufacturing model and secure supply chain, with front-end manufacturing of VD56GA takes place at ST’s facility in Crolles, France and packaging in Asia; reinforcing the company’s focus on industrial resilience, product quality, and supply continuity for automotive customers worldwide. 

Availability 

Samples are available now. Pricing information and sample requests are available from local ST sales offices. 

Learn more: https://www.st.com/en/imaging-and-photonics-solutions/vd56ga.html

Leopard-Lumotive collaboration

Link: https://www.prnewswire.com/news-releases/leopard-imaging-and-lumotive-introduce-sirius-max--a-long-range-software-defined-3d-perception-platform-for-robotics-and-ai-302889658.html 

Leopard Imaging® and Lumotive Introduce "Sirius Max" -- A Long-Range Software-Defined 3D Perception Platform for Robotics and AI

 FREMONT, Calif., Sept. 24, 2026  -- Leopard Imaging®, a global leader in AI perception and spatial intelligence solution design and manufacturing, together with Lumotive, a pioneer in programmable optical semiconductor technology, today announced Sirius Max (LI-AR0234-AF0130-TX10-GMSL2-140H), a next-generation solid-state 3D LiDAR designed for advanced AI perception, robotics, industrial automation, autonomous machines, and intelligent edge systems.

Powered by Lumotive's programmable beam-steering technology and Leopard Imaging's high-performance embedded AI Perception expertise, Sirius Max delivers a compact, low-power, and software-defined 3D sensing solution optimized for next-generation machine vision and AI perception applications.

Sirius Max is Leopard Imaging's next-generation long-range RGB + depth perception platform, combining high-performance imaging, intelligent iToF depth sensing and processing, embedded synchronization, and programmable beam-steered illumination into a fully integrated GMSL2 camera system capable of real-time RGB-depth fusion and long-range active depth perception.

Unlike conventional flood-illumination ToF systems, Sirius Max utilizes directional beam steering to dynamically control illumination and depth scanning. This architecture significantly improves optical efficiency, ambient light rejection, signal-to-noise ratio, and long-range sensing performance while maintaining a fully solid-state design with no moving mechanical components.

The platform enables software-defined scanning and programmable sensing regions, opening new possibilities for intelligent perception systems in humanoid robotics, autonomous navigation, automotive monitoring, industrial automation, and smart infrastructure.

"Sirius Max represents a major advancement in programmable optical perception systems," said Bill Pu, CEO of Leopard Imaging. "By combining Leopard Imaging's AI perception and spatial intelligence expertise with Lumotive's breakthrough beam-steering technology, Sirius Max delivers long-range, software-defined 3D perception in a compact embedded platform. We are enabling AI systems to perceive farther, react faster, and perform more intelligent tasks with a single sensor platform."

"Leopard Imaging has extensive experience delivering high-performance embedded camera systems for AI and edge computing applications," said Apurva Jain, Senior Vice President of Product & Marketing at Lumotive. "Together, Sirius Max combines Lumotive's programmable beam-steering technology with Leopard Imaging's high-performance imaging platform to extend iToF sensing performance beyond 20 meters in both indoor and outdoor environments. With 1MP depth resolution and software-defined scanning capabilities, customers can leverage a single sensor platform for applications such as SLAM, collision avoidance, object handling, and navigation. Sirius Max enables AI systems to detect objects farther away, operate at higher speeds, and perform more intelligent tasks while reducing overall system complexity."

Advanced AI Perception Architecture

Sirius Max integrates synchronized RGB imaging, intelligent iToF depth sensing and processing, embedded processing, and Lumotive's TX10 programmable beam-steering transmitter into a compact GMSL2 camera module platform optimized for real-time AI perception workloads.

The platform supports synchronized RGB video, depth data, and control transmission over a single coaxial cable, simplifying integration into advanced embedded computing and edge AI systems. Through programmable scanning and region-of-interest control, Sirius Max can consolidate multiple sensing functions into a single camera platform. Customers can leverage one sensor for applications such as SLAM, cliff detection, collision avoidance, visual inspection, object handling, and navigation, reducing system complexity while improving performance and deployment flexibility.

Core technologies include

-   High-performance RGB imaging with integrated ISP
-   Intelligent iToF depth sensing based on the onsemi AF0130 depth sensor
-   Lumotive's LCM programmable beam-steering module

Key Features of Sirius Max

-   Solid-state wide-field-of-view RGB-D perception architecture
-   High resolution extended-range depth perception in indoor and outdoor conditions
-   Software-defined sensing in regions of interest
-   Compact, low-power embedded camera module design
-   Enhanced dynamic range, reduced multipath, and reduced saturation noise in all conditions
-   Embedded processing and synchronization
-   Low-latency GMSL2 connectivity
-   Optimized for robotics, industrial automation, automotive, and edge AI applications