PR Newswire: Up to now there were two non-overlapping types of MEMS gyro chips: low sensitivity ones for user interface functions and high-sensitivity gyros used primarily for image stabilization applications. The low sensitivity gyros were intended to recognize coarse movements in range of tens of degrees, but their noise and drift was beyond the requirements of image stabilization systems. The high sensitivity gyros had low noise and drift, but their dynamic range was limited to few degrees, too small for user interface.
Now ST claims to overcome this limitation in its L3G4IS dual-core gyroscope employing separate output paths optimized for the two different functions in a 4x4x1 mm package. The device is said to address, at the same time, motion and gesture recognition and optical image stabilization.
"ST's dual-core gyroscope lights two candles with one flame," said Benedetto Vigna, Corporate Vice President and General Manager of ST's Analog, MEMS and Sensors Group. "Instead of using two dedicated sensors with significantly different specifications, phone and tablet manufacturers can now simply integrate a single gyroscope for both gesture recognition and camera image stabilization, which enables more reliable performance, sleeker form factors, and lower costs."
ST's L3G4IS dual-core gyroscope is sampling now and volume production is scheduled for Q2 2012, with unit pricing at $3.9 for volumes in the range of 1,000 pieces.
Friday, January 06, 2012
Thursday, January 05, 2012
Fujifilm DSLR Uses New Color Filter Pattern
A number of sources in DSLR community discuss prematurely leaked Fujifilm PR on its new DSLR. The PR says that the camera "features a custom-developed 16-megapixel APS-CMOS sensor incorporating a new filter array and the company's proprietary EXR processor technology". The French magazine Reponses Foto gives few more details on the new color filter and claims that the new sensor uses a random 6-pixel color filter pattern randomized pattern with 6 pixels that eliminates Moire patterns, so no anti-aliasing filter is needed.
The new X-PRO 1 camera is supposed to be officially presented at CES next week. I hope more details on color filter would be released.
Thanks to SH for sending me the link!
The new X-PRO 1 camera is supposed to be officially presented at CES next week. I hope more details on color filter would be released.
Thanks to SH for sending me the link!
Lattice Merges Two Video Streams from Aptina Sensors
Marketwire: Lattice Semiconductor, in collaboration with Aptina, announced that it will be demonstrating a low cost, dual image sensor refence design at the CES.
The dual image sensor design utilizes two Aptina MT9M024/MT9M034, 720P image sensors and combines the image into a single bus on which an ISP can operate. The output stream can be used to implement 3D stereoscopic video or for other multi-camera applications. The low cost of the solution enables other consumer applications such as automotive black box drive recorders and surround view cameras. The low cost, low power Lattice MachXO2 PLD and a small SDRAM chip implement the necessary logic and frame buffering that allow the two image sensors to be merged into one ISP bus.
"We are pleased to offer this dual image sensor design, which allows ISP vendors to quickly offer multiple camera solutions for the consumer market," said Ted Marena, Director of Business Development for Lattice. "By leveraging the Aptina HiSPi (High speed Serial Pixel interface) bus of the MT9M024/MT9M034, we were able to select a smaller I/O package for the Lattice MachXO2 device, which helped lower the cost."
The dual image sensor design utilizes two Aptina MT9M024/MT9M034, 720P image sensors and combines the image into a single bus on which an ISP can operate. The output stream can be used to implement 3D stereoscopic video or for other multi-camera applications. The low cost of the solution enables other consumer applications such as automotive black box drive recorders and surround view cameras. The low cost, low power Lattice MachXO2 PLD and a small SDRAM chip implement the necessary logic and frame buffering that allow the two image sensors to be merged into one ISP bus.
"We are pleased to offer this dual image sensor design, which allows ISP vendors to quickly offer multiple camera solutions for the consumer market," said Ted Marena, Director of Business Development for Lattice. "By leveraging the Aptina HiSPi (High speed Serial Pixel interface) bus of the MT9M024/MT9M034, we were able to select a smaller I/O package for the Lattice MachXO2 device, which helped lower the cost."
Dongbu Discloses Its Medical Sensor Projects
Business Wire: Dongbu HiTek announced that it has been certified to meet all quality management criteria set forth in the ISO13485 standard for the medical devices. Dongbu reports that it has partnered with fabless companies to implement CMOS image sensors for endoscope and x-ray systems as well as for computed tomography (CT) scanners.
Wednesday, January 04, 2012
Tessera CEO on MEMS AF Bright Future
Business Wire: Tessera CEO and President Robert A. Young sent a letter to shareholders talking about bright future of its Digital Optics division (DOC):
"Growth Opportunity: Digital Optics
It may surprise those who have tracked the success of our Micro-electronics business to learn that our largest growth opportunity today is in our Digital Optics business (formerly known as Imaging & Optics).
The most bulky component in today’s mobile phones is the camera module. Some of today’s Android phones even feature a “bump” made necessary by the nearly obsolete technology now found in all mobile phone camera modules, built around magnetic coil technology that is over 100 years old and has reached its effective limits of miniaturization.
We will introduce camera modules based on silicon rather than magnetic coils to move the lenses for focusing and zoom. This breakthrough MEMS technology is disruptive because it obsoletes the magnetic coils in use today by enabling cameras that are thinner, much faster, have more accurate lens positioning, and use far less battery power. When combined with the other software and technologies that we have already have developed and marketed, it means better quality images and video from miniature mobile phone cameras. Our technologies will enable mobile phone cameras to perform as well as standalone digital still cameras and to compete with video cameras on quality. We are discussing our offerings with Tier One OEM manufacturers of wireless handsets, and expect to ship our game-changing products in late 2012.
Milestones Ahead
In short, we have positioned our Digital Optics business with the right technologies and people to exploit a large and growing market that has yet to see the kind of transformative innovation that’s been common in other consumer electronics businesses.
The major milestones that you can expect this coming year:
"Growth Opportunity: Digital Optics
It may surprise those who have tracked the success of our Micro-electronics business to learn that our largest growth opportunity today is in our Digital Optics business (formerly known as Imaging & Optics).
The most bulky component in today’s mobile phones is the camera module. Some of today’s Android phones even feature a “bump” made necessary by the nearly obsolete technology now found in all mobile phone camera modules, built around magnetic coil technology that is over 100 years old and has reached its effective limits of miniaturization.
We will introduce camera modules based on silicon rather than magnetic coils to move the lenses for focusing and zoom. This breakthrough MEMS technology is disruptive because it obsoletes the magnetic coils in use today by enabling cameras that are thinner, much faster, have more accurate lens positioning, and use far less battery power. When combined with the other software and technologies that we have already have developed and marketed, it means better quality images and video from miniature mobile phone cameras. Our technologies will enable mobile phone cameras to perform as well as standalone digital still cameras and to compete with video cameras on quality. We are discussing our offerings with Tier One OEM manufacturers of wireless handsets, and expect to ship our game-changing products in late 2012.
Milestones Ahead
In short, we have positioned our Digital Optics business with the right technologies and people to exploit a large and growing market that has yet to see the kind of transformative innovation that’s been common in other consumer electronics businesses.
The major milestones that you can expect this coming year:
- First half of 2012: We will sign our first design win for the use of our transformational MEMS optical imaging technology in a new cell phone.
- Second half of 2012: We will announce major steps toward high-volume manufacturing of devices using this MEMS technology."
CEVA Announces ISP IP
CEVA announced the availability of its first imaging and vision platform based on its CEVA-MM3000 architecture framework. CEVA-MM3101 is a programmable, low power platform targeting image and video processing in camera-enabled devices, including smartphones, tablets and smart TVs.
The CEVA-MM3101 platform integrates image and video pipeline, image enhancement, embedded vision applications and image encoding functions. Instead of using fixed-function engines or running these functions on the main application processor, the CEVA-MM3101 is specifically architected to support all of these functions on a single processor, resulting in a 20X reduction in power consumption when compared to CPU-based solutions.
The CEVA-MM3101 is capable of processing video streams of 1080p, or 8MP images at 12 fps, with video stabilization, color correction, wide dynamic range (WDR), face detection and gesture recognition.
CEVA has collaborated with eyeSight to deliver a comprehensive offering for Human Machine Interface (HMI), based on the CEVA-MM3101 platform. eyeSight's offering includes hand gesture recognition and virtual mouse user interface technology using finger tracking for multiple users in various conditions. CEVA and eyeSight will demonstrate a range of real-world applications for this technology at CES 2012.
At the heart of the CEVA-MM3101 is a programmable Vector Processing (VP) engine. The Vector Processor performs filtering and the vector-type operations required for pixel processing. It is based on a dedicated pixel-processing VLIW/SIMD architecture with 10-stage pipeline. It contains 7 different units that can work in parallel enabling flexible combination for different type of instructions. All instructions are conditional execution using predication optimized to save code size. The VP can handle 32 byte operations in one cycle and contains special instructions that can be configured in order to create proprietary filters for video and imaging processing. This strong processor is optimized for multimedia operations, capable of 64 SAD calculations in one cycle as well as producing 8 results for 6 Tap filters – which make it ideal for image signal processing algorithms.
The CEVA-MM3101 platform integrates image and video pipeline, image enhancement, embedded vision applications and image encoding functions. Instead of using fixed-function engines or running these functions on the main application processor, the CEVA-MM3101 is specifically architected to support all of these functions on a single processor, resulting in a 20X reduction in power consumption when compared to CPU-based solutions.
The CEVA-MM3101 is capable of processing video streams of 1080p, or 8MP images at 12 fps, with video stabilization, color correction, wide dynamic range (WDR), face detection and gesture recognition.
CEVA has collaborated with eyeSight to deliver a comprehensive offering for Human Machine Interface (HMI), based on the CEVA-MM3101 platform. eyeSight's offering includes hand gesture recognition and virtual mouse user interface technology using finger tracking for multiple users in various conditions. CEVA and eyeSight will demonstrate a range of real-world applications for this technology at CES 2012.
At the heart of the CEVA-MM3101 is a programmable Vector Processing (VP) engine. The Vector Processor performs filtering and the vector-type operations required for pixel processing. It is based on a dedicated pixel-processing VLIW/SIMD architecture with 10-stage pipeline. It contains 7 different units that can work in parallel enabling flexible combination for different type of instructions. All instructions are conditional execution using predication optimized to save code size. The VP can handle 32 byte operations in one cycle and contains special instructions that can be configured in order to create proprietary filters for video and imaging processing. This strong processor is optimized for multimedia operations, capable of 64 SAD calculations in one cycle as well as producing 8 results for 6 Tap filters – which make it ideal for image signal processing algorithms.
Tuesday, January 03, 2012
Fraunhofer Announces Lateral Drift Photodetector
Electronics Weekly, Physorg: Fraunhofer January 2012 News Magazine announced a lateral drift photodetector (LDPD) which boosts the speed of traditional CMOS sensors so removing the drawbacks of Pinned Photodiodes (PPD) using pixel size 10 µm or above.
"...when the pixels exceed a certain size, the PPDs have a speed problem", explains Werner Brockherde, head of department at the Fraunhofer Institute for Microelectronic Circuits and Systems IMS. Low-light applications tend to call for high image rates. "But the readout speed using PPD is too low", says Brockherde.
The Fraunhofer researchers have developed a new photodiode, the lateral drift field photodetector (LDPD), that is said to be unique and has already been patented. "In this component, the charge carriers generated by the incident light move at high speed to the readout node," explains the researcher. With the PPD the electrons are said to diffuse to the exit; a comparatively slow process but which is sufficient for many applications. "But by integrating an internal electric fi eld into the photoactive region of the component, we have managed to accelerate this process by a factor of up to a hundred."
To produce the new LDPD, the Fraunhofer researchers improved upon the currently available CMOS chip manufacturing process based on the 0.35 μm standard: "The additional LDPD component must not be allowed to impair the properties of the other components," says Brockherde. The prototype of the new high-speed CMOS image sensors is already available. "We expect to get approval for series production next year," says Brockherde.
"...when the pixels exceed a certain size, the PPDs have a speed problem", explains Werner Brockherde, head of department at the Fraunhofer Institute for Microelectronic Circuits and Systems IMS. Low-light applications tend to call for high image rates. "But the readout speed using PPD is too low", says Brockherde.
The Fraunhofer researchers have developed a new photodiode, the lateral drift field photodetector (LDPD), that is said to be unique and has already been patented. "In this component, the charge carriers generated by the incident light move at high speed to the readout node," explains the researcher. With the PPD the electrons are said to diffuse to the exit; a comparatively slow process but which is sufficient for many applications. "But by integrating an internal electric fi eld into the photoactive region of the component, we have managed to accelerate this process by a factor of up to a hundred."
To produce the new LDPD, the Fraunhofer researchers improved upon the currently available CMOS chip manufacturing process based on the 0.35 μm standard: "The additional LDPD component must not be allowed to impair the properties of the other components," says Brockherde. The prototype of the new high-speed CMOS image sensors is already available. "We expect to get approval for series production next year," says Brockherde.
Monday, January 02, 2012
Max Collet Passed Away
Albert Theuwissen published that Max Collet, the head of Image Sensor R&D group of Philips Research in the 80’s passed away at the age of 70.
Superpix Announces New Sensors
Contrary to the previously published rumors, Beijing, China-based Superpix announced a bunch of new sensors targeting consumer market.
The company information page says it has "developed a board range of high performance image sensor and relative image process chip, and most of them achieved domestic advanced level. Up to now, there are over 50 million chips had been sold. And based on customers’ comments, the products are stable and reliable. The latest 12MP CMOS image sensor is the very first domestic product beyond 10MP, which represents the highest level of that field in China. The company has been appraised “100 Innovative Experiment Enterprises” by ministry of science and technology, and won the honor of “A Level Credit Outstanding Corporation”".
The company product range spans from 1/15-inch 0.08MP to APS-C 12MP sensors. The pixel size range is from 1.75um used in 2MP sensor to 6um in APS-C DSLR one. The package options include TSV:
The 2MP 1/5-inch SP2518 is said to be "based on the 3rd generation 1.75um CMOS image sensor pixel architecture designed by SuperPix". With Integrated ISP it consumes 220mW power. The reported dark current is 40e/s at 60C. The maximum SNR is 38dB, quite in line with other sensors with similar pixel size. The summary table above says SP2518 is able to work at 15fps speed, the product page claims 13fps at full 1600 x 1200 resolution, while the product flyer says the speed is "up to 12fps" at full resolution.
Another interesting product is SP8AC08 12MP APS-C DSLR sensor. "The SP8AC08 is a high quality and low power consumption 12 mega pixel image sensor capable of capturing color digital images. 4260(V) x 2840(H) active pixels are incorporated in and each pixel size is 6 um. High Sensitivity, High SNR, and Low dark current also are the advantages can’t be ignored. These particularities will result in extremely visual impression. SP8AC08 is the first homemade CMOS image sensor which has resolution up to 12 mega pixel." Here is the sensor's spec:
The company information page says it has "developed a board range of high performance image sensor and relative image process chip, and most of them achieved domestic advanced level. Up to now, there are over 50 million chips had been sold. And based on customers’ comments, the products are stable and reliable. The latest 12MP CMOS image sensor is the very first domestic product beyond 10MP, which represents the highest level of that field in China. The company has been appraised “100 Innovative Experiment Enterprises” by ministry of science and technology, and won the honor of “A Level Credit Outstanding Corporation”".
The company product range spans from 1/15-inch 0.08MP to APS-C 12MP sensors. The pixel size range is from 1.75um used in 2MP sensor to 6um in APS-C DSLR one. The package options include TSV:
The 2MP 1/5-inch SP2518 is said to be "based on the 3rd generation 1.75um CMOS image sensor pixel architecture designed by SuperPix". With Integrated ISP it consumes 220mW power. The reported dark current is 40e/s at 60C. The maximum SNR is 38dB, quite in line with other sensors with similar pixel size. The summary table above says SP2518 is able to work at 15fps speed, the product page claims 13fps at full 1600 x 1200 resolution, while the product flyer says the speed is "up to 12fps" at full resolution.
Another interesting product is SP8AC08 12MP APS-C DSLR sensor. "The SP8AC08 is a high quality and low power consumption 12 mega pixel image sensor capable of capturing color digital images. 4260(V) x 2840(H) active pixels are incorporated in and each pixel size is 6 um. High Sensitivity, High SNR, and Low dark current also are the advantages can’t be ignored. These particularities will result in extremely visual impression. SP8AC08 is the first homemade CMOS image sensor which has resolution up to 12 mega pixel." Here is the sensor's spec:
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