Friday, September 08, 2017

SEMI European Imaging & Sensors Summit 2017

SEMI European Imaging & Sensors Summit 2017 is to be held on September 20-22 in Grenoble, France. The summit agenda has many interesting presentations:

  • Sensor as a solution
    Chae Lee, Senior VP, LG Electonics
  • In the era of mixed reality and augmented environment sensing, what does innovation mean? What is Leti’s vision?
    Marie Noelle Semeria, CEO, Cea-Leti
  • 3D Time-of-Flight Cameras in Industrial Applications
    Thomas Kuhnke, Senior Electronics Design Engineer, 3D Business, Basler AG
  • Hybrid semiconductor direct conversion CMOS x-ray imaging detectors with application examples
    Tuomas Pantsar, Chief Technology Officer / Charge Integration, Oy Ajat
  • CMOS based microdisplays, imager and sensors enhanced by OLED/OPD integration
    Philipp Wartenberg, IC Design Engineer and Project Manager / Deputy head of department IC and System Design, Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP
  • TSMC Imaging Technology to Enable Innovation in AR/VR Applications
    Tripti Bhanti, Senior Technical Manager, TSMC Europe BV
  • Fusion Bonding Enabler for Backside Illuminated Image Sensors - What’s Next
    Thomas Uhrmann, Director of Business Development, EVG
  • Technological Trends in Thermal Image Sensors
    Christel-loic Tisse, Technical & Innovation Director, ULIS
  • Packaging of Image Sensors and Devices
    Lutz Mattheier, Manager Assembly Technology Development, First Sensor Microelectronic Packaging GmbH
  • Image Fusion: How to Best Utilize Dual Cameras
    Roy Fridman, Director of Product Marketing, Corephotonics
  • High Performance CMOS Integrated Graphene Photodetectors
    Tapani Ryhänen, CEO, Emberion
  • CMOS image sensor for bio-medical and scientific applications
    Renato Turchetta, CEO, IMASENIC
  • New developments in logarithmic pixels and sensors
    Yang Ni, Founder & CTO, NIT
  • Colour X-ray Imaging Solutions for Non-Destructive Testing based on Photon Counting Technology
    Juha Kalliopuska, Chief Executive Officer and Co-founder, ADVACAM
  • High resolution global shutter image sensors for machine vision and 8K video
    Guy Meynants, Engineering Fellow, ams/CMOSIS
  • VTT’s hyperspectral imaging technology - from high-performance applications towards volume scalability
    Anna Rissanen, Research Team Leader, VTT
  • Image Sensors for Future VR
    Yiwan Wong, Partnership Lead, Oculus Research
  • Ambient Sensing – New ways how intelligent devices can cope with the environment
    Roland Helm, Segment Head Sensors, Infineon Technologies AG

Leti Announces High Resolution Fingerprint Pressure Sensing Technology

Leti announces readiness of the new technology of very high-resolution (>1000 dpi) fingerprint sensor based on a matrix of interconnected piezoelectric ZnO nanowires:

Sony CineAlta Venice Features Full-Frame 4K 60fps Sensor

Sony announces Venice - the next generation digital cinema camera featuring 4K full-frame sensor capable of 60fps or 6K at 30fps speed. Venice is said to have a high speed readout which minimizes the jello effects typical in the CMOS sensors. The new sensor DR is promised to achieve 15+ stops.

Thursday, September 07, 2017

Automotive LiDAR Companies Raise $216M in One Month

Recently, automotive LiDAR startups attract a lot of VC money:

LeddarTech announces a combined investment of US$101m led by Osram and including Delphi, Magneti Marelli and Integrated Device Technology as strategic investors, as well as Fonds de solidarité FTQ. This round of funding will allow LeddarTech to enhance its ASIC development efforts, expand its R&D team, and accelerate ongoing LiDAR development programs with select Tier-1 automotive customers for rapid market deployment.

We are thrilled to welcome such an influential group of companies as strategic investors, with whom we share a common goal of making mobility safer and more efficient,” stated Charles Boulanger, LeddarTech’s CEO. “Their strong endorsement is a testament to the maturity of the Leddar technology and the credibility of our product roadmap to support the ongoing development of autonomous driving. This positions LeddarTech as the definitive reference in solid-state LiDAR and validates our Tier-1 partnership business model to rapidly deploy LiDARs on a commercial scale in automotive applications. We believe this announcement represents a major stepping stone towards achieving market-share leadership in the multibillion-dollar automotive LiDAR market by 2020.


PRNewswire: Innoviz has raised $65m in Series B funding as its LiDAR moves into mass production. Delphi Automotive PLC and Magna International participated in the round, along with additional new investors including 360 Capital Partners, Glory Ventures, Naver and others. All Series A investors, including Zohar Zisapel, Vertex Venture Capital, Magma Venture Partners, Amiti Ventures and Delek Motors, participated in this round. A second closing of this round is expected to be announced soon, introducing additional strategic partners.

"As the autonomous driving market matures, Innoviz has clearly established itself among industry leaders not only as the best-in-class LiDAR solution but also as an integral part of the overall autonomous vehicle stack," said Omer Keilaf, Co-founder and CEO of Innoviz. "Today's financing from strategic partners such as Magna and Delphi demonstrates their support for Innoviz as the industry's leading option for high-performing LiDAR and is further proof that we have moved into the next phase of our growth. Given both Magna's and Delphi's unwavering commitment to high performance and high safety standards, investing in and partnering with Innoviz is a natural choice. With their joint efforts, we will be able to scale more quickly and put autonomous driving technology on the road much faster."

Innoviz technology that leverages the company's proprietary System, MEMS and Detector designs to give autonomous vehicles sensing capabilities even in challenging environments such as bright direct sunlight, varying weather conditions and multi-LiDAR environments.



Oryx Vision announces a $50m Series B funding round. Third Point Ventures and WRV led the round, which was joined by Union Tech Ventures, and existing investors Bessemer Venture Partners, Maniv Mobility and Trucks VC. A mere 15 months after its first funding round, this fundraise brings the total investment in Oryx to $67M.

Oryx will use the new funds to accelerate its development activities and to intensify its commercial engagements with car OEMs, tier-1 supplier and technology players. Having demonstrated the unique capabilities of its technology over the past year, the company expects to ship units for car-mounted testing in the second half of 2018.

Oryx is building the first solution that will meet all the key requirements of automotive LiDARS – high performance, car durability and low price – without a tradeoff. We are delighted to receive a vote of confidence in our vision from such sophisticated investors, and to have the resources to bring this technology to market quickly and at the highest quality,” says Rani Wellingstein, Oryx co-founder and CEO.

From Oryx Vision presentation:

Wednesday, September 06, 2017

On the Use of White Light Source for Imager Spectral Response Measurements

Aphesa publishes a blog post "Why You Can't Use A White (Broad Spectrum) Light Source For Your Spectral Measurements." Few quotes:

"The R, G, B or the monochrome curve is not the response curve of the sensor but only some information about it.

First of all, it is usually only measured for an incident beam perpendicular to the sensor, or in other words at a zero chief ray angle. But we know that the spectral response varies in intensity and in shape with the angle of incidence.

Secondly, it is a noisy measurement and therefore the precision depends on the number of samples taken. The measurement is noisy because the amount of light after the monochromator is limited as only a tiny fraction of the source's spectrum reaches the sensor. Therefore the signal level is small and its SNR is therefore low.

The shape of the spectrum also depends on the bandwidth of the measuring instrument. As the response spectrum can exhibit oscillations at several scales (see this other publication about spectral response), only a very small bandwidth, i.e. a narrow monochromator lid, can reproduce the actual shape of the response curve, any other approach will only produce a smoothed curve without any detail.

Finally, the wide band light source will change over time and its spectrum will change over temperature, therefore requiring regular calibration.

The light source that we use is based on a femtosecond laser and a supercontinuum.

The femtosecond laser is a solid laser that provided very high power light pulses with a duration in the range of the femtosecond. Lasers are known to provide coherent, repeatable and high intensity light. Our laser is red and the laser has the size of a small table.

The role of the supercontinuum is to turn the monochromatic laser light into a wide spectrum by a collection of non-linear processes. The supercontinuum is a long microstructured optical fiber. The fiber seems red at its beginning and is white in the end as the spectrum broadens along the fiber.
"

Tuesday, September 05, 2017

Sony Fab Tour

Dave Etchells from Imaging Resource publishes a nice overview of Sony image sensor fab. It describes a process of growing the silicon boules by Czochralski method in great details, then gets sketchy on photolitography and other FEOL and BEOL steps, then again goes into much more details on dicing, wire bonding, and packaging. While very simplistic, the article describes quite a complete process flow at Sony Kumamoto fab.

Emberion Startup Promises Graphene Image Sensors

Espoo-Finland and Cambridge, UK-based startup Emberion is a spin-off of Nokia. The new company works to commercialize graphene-based microbolometric image sensors:


Monday, September 04, 2017

Intelligence in Smart CMOS Image Sensors

Fayçal Saffih from University of Waterloo, Canada publishes his video lecture on "Implementations of Intelligence on Smart CMOS Image Sensors" given on Sept. 1, 2017 in York University:

Sunday, September 03, 2017

Huawei Kirin 970 Features AI Co-Processor

Huawei unveils Kirin 970 mobile SoC "combining the power of the cloud with the speed and responsiveness of native AI processing."

"Mobile AI = On-Device AI + Cloud AI. HUAWEI is committed to developing smart devices into intelligent devices by building end-to-end capabilities that support coordinated development of chips, devices, and the cloud. The Kirin 970 is the first in a series of new advances that will bring powerful AI features to our devices and take them beyond the competition," says Richard Yu, CEO of Huawei Consumer Business Group.

ST Presentation on Automotive HDR Processing Pipeline

Autosens publishes ST presentation on its HDR ISP for automotive cameras from the converence in Detroit in May 2017: