Canon Developed 8" by 8" CMOS Sensor

Imaging Resource, CNET: Canon announced that it has successfully developed the world's largest CMOS image sensor, with a chip size measuring 202 x 205 mm2. The newly developed CMOS sensor is among the largest chips that can be produced from a 12-inch wafer, and is approximately 40 times the size of Canon's largest commercial CMOS sensor. By ensuring the cleanroom environments during the production process, Canon minimizes image imperfections and dust.

Canon said it has solved large sensor speed problem through an innovative circuit design, making possible the realization of a massive video-compatible CMOS sensor. The sensor makes possible the image capture in one one-hundredth the amount of light required by a 35 mm full-frame CMOS sensor, facilitating the shooting of 60 frame-per-second video with a mere 0.3 lux of illumination, about one-half the brightness of a moonlit night.

Potential applications for the new high-sensitivity CMOS sensor include the video recording of stars in the night sky and nocturnal animal behavior.

No word is said on the sensor resolution or its pixel size. Also, it's not clear what fab Canon used to produce that large sensor. The picture below compares the new sensor with a full-frame 35mm one:

Update: Tech-On presents more details on the Canon's giant sensor. Its pixel pitch is 160um and the resolution is just 1.6MP.

Update #2: Imaging Resource published Canon Expo 2010 report mentioning a huge 300mm wafer-sized sensor. I'm not sure this is the same sensor, as report mentions 600um pixel size, 1MP resolution - the numbers do not make sense. Even assuming 300mm per side (exact size is not mentioned in the report), there would be only 500 x 500 pixels, much below the stated 1MP. The minimum illumination is 1 Lux. The sensor is currently used in a telescope in Japan. Here is the picture from the report:

Aptina Announced 8MP Camera Solution

Business Wire: Aptina announced the availability of a new feature-rich 8MP CCS8140 imaging solution combining MT9E013 8MP image sensor with MT9E311 imaging co-processor while maintaining speeds similar to a standalone image processor. The CCS8140 complete camera solution requires only minimal tuning and sensor adjustments to complete the final product design.

CCS8140 solution offers advanced functionality, such as face and scene detection, and enabling new applications such as visual search. The CCS8140 solution offers up to 250MP/second throughput processing, enabling low latency, low shutter lag, and fast 1080p/30fps HD video recording over two-lane MIPI output.

"Traditionally, camera module integrators and mobile handset OEMs have had to source their 8MP sensor and co-processing solution from two different sources, and then spend considerable time and resources in tuning for image quality" said Farshid Sabet, VP and GM of Aptina's Mobile, PC Gaming Business Unit at Aptina. "With the SoC-like configuration of the Aptina CCS8140 imaging solution, we are removing the compatibility and cost concerns associated with using standalone components and the image processing and improving performance beyond SoCs. We are pleased to provide a complete camera solution in a form that allows module integrators and handset OEMs to meet stringent time-to-market requirements, while lowering design risk and costs."

CCS8140 solution is sampling now as bare die or as packaged parts. Mass production is scheduled for CYQ4 2010.

Omnivision Announces 720p Video BSI Sensor

PR-Newswire: Omnivision introduced the OV9740, a 1/6.5-inch SOC image sensor delivering native 720p/30fps HD video. 1.75um pixel OmniBSI technology enables the OV9740 to deliver low-light sensitivity at 1300 mV/lux-sec in ultra-thin camera modules of less than 3.2 mm.

OV9740 integrates automatic WB, color noise reduction in the YUV domain, automatic exposure, automatic gain control, auto black level calibration, gamma correction, defect pixel correction, edge enhancement, lens correction, and dual lane MIPI interface.

The OV9740 is sampling now and is expected to enter mass production in September 2010.

WRGB LOFIC Sensor Shows 2x Sensitivity

ASPDAC 2010 has Tohoku University's paper on WRGB LOFIC sensor:

Checkered White-RGB Color LOFIC CMOS Image Sensor
Shun Kawada, Shin Sakai, Yoshiaki Tashiro and Shigetoshi Sugawa
Tohoku University, Japan

WRGB pattern is said to improve sensitivity by a factor two as compared with RGB sensor. Here is the pixel and color filter layout:

Caeleste on X-Ray Photon Counting Sensors

Caeleste published its invited presentation on X-Ray Photon Counting Sensors at OSA Symposium, Tucson, June 2010.

CMOSIS Announced NIR-Enhanced Versions of its 5.5um-Pixel Products

CMOSIS announced NIR-enhanced versions of its 2.2MP CMV2000 and 4MP CMV4000 sensors. Both sensors are based on 5.5um pixels processed on 12um epi wafers. The thicker epi improves 900nm QE from 8% in the standard sensors to 18% in the NIR-enhanced one.

CMV2000 and CMV4000 E12 devices are available in sample quantities.

According to 2009 Strategies Unlimited presentation, such specialty sensors represent a nice chunk of the market, especially in revenue numbers:

Hynix Plans and Progress Update

Hynix 2010 sustainability report for the UN has an interesting update on the company CIS activity (page 40):

"Since August 2009, Hynix has been supplying 300K and 2-megapixel CMOS Image Sensors for Korean cell phone users. Due to the extraordinarily favorable response and feedback from customers, the number of cell phone models adopting Hynix’s CMOS Image Sensor is expected to grow continuously. In February 2009, Hynix began developing 1.3-megapixel CMOS Image Sensors from design stage to quality assurance. The company also laid the foundation for the stable supply of high-quality CMOS Image Sensors by securing more than 90 percent of the 300K-pixel market and 85 percent of the 2-megapixel market based on yield rates. In November 2009, Hynix also completed a roadmap for organization and integrated design so as to reduce inefficiency which resulted in the separate development of products by Hynix, SiliconFile, and Hynix Semiconductor America Inc.’s research center. This has led to more effective project management and an optimal design process, which is expected to increase the company’s development capabilities. Hynix aims to develop 5- and 8- megapixel products using the world’s smallest 1.4-micron pixel and is currently developing a back-illuminated CMOS Image Sensor and ultra-fine pixel with the goal of entering the DSLR and hybrid camera market in 2011. In the future, Hynix will enhance its position in the CMOS Image Sensor market even further by expanding the scope of its target markets and diversifying applications based on strengthened capabilities."

So, while not clearly written, it appears that Hynix is going to enter DSLR sensor market with BSI sensor having small pixel pitch - this might be an interesting product.

Another interesting observation is that Hynix lists Siliconfile as its subsidiary (page 15). Together with apparent integration of Siliconfile design in the Hynix plans, it looks like Siliconfile is completely absorbed by Hynix.

Sony Announces New CCDs for Effio Security Platform

Sony CX-News Vol. 61 has an announcement of 1/3-inch ICX672AKA/ICX673AKA (NTSC/PAL) CCDs. The CCDs have 960 pixels horizontal effective resolution (960H sensors) intended for use in "Effio" platform. The sensors are dubbed "EXview HAD CCD II" and improve light efficiency by including near infrared light region as a basic structure of Sony's "EXview HAD CCD". They realize sensitivity of 1000mV (typ) or more per 1 μm2 (Color: F5.6/BW: F8 in 1 s accumulation equivalent).

NTSC ICX672AKA pixel size is rectangular 5 x 7.4 sq.um, while PAL version ICX673AKA has 5 x 6.26 sq.um pixels.

Omnivision Q1/FY2011 Earnings Call

Seeking Alpha published Omnivision quarterly earnings call transcript. Some interesting quotes from Q&A session:

Raj Gill – Needham & Company:

...could you describe a little bit about your market share position in the camera phone market? Did you feel that you are gaining share against your competitors? Where do you see upside? And maybe describe a little bit about your technology – “technology leadership” in BSI-1 and BSI-2 relative to your competitors. How do you characterize that?

Ray Cisneros, VP, Worldwide Sales:

...our BSI position backing into some high value projects, high value customers, represents a significant market share gain. Now, obviously that’s just an opinion. We will have to wait till the market analysts quenched our numbers when the calendar year closes out. But that’s our opinion going forward. In regards to technology of BSI, obviously to ship the quantities that we are shipping today, it’s a long learning curve. We regard that as extremely a big advantage to OmniVision, and our competitors will probably face that step when they get to it. And it’s not easy to ship the volumes we have.

Betsy Van Hees – Wedbush:

You guys talked about the competition in BSI, and I think the commentary was that you guys remain ahead of the competition. Could you please give us a little bit more color behind that and what's differentiating you and why are you so far ahead of the competition?

Bruce Weyer, VP Marketing:

We have been developing the backside illumination technology with our strategic partner TSMC for many years. This has been a five-year effort for us. And there has been a tremendous amount of intellectual property developed between the two companies in that process. And that’s very hard to reproduce and is very hard to reproduce in a short time period. So if you look at our success and the growth we’ve seen, it’s really been fueled by BSI. So that should give you an indication that a great portion of that learning has already taken place for us. So we think that as a big barrier for the competition.

Yair Reiner – Oppenheimer & Company:

...traditionally, in the CMOS unserved market, like-for-like prices tend to drop on the order of 20%, 25% a year. ...Should we expect BSI chips to kind of follow those same patterns over the next year or two?

Ray Cisneros

...going forward, everything we could possibly do, we try to prevent similar type of price erosion that we’ve seen in our standard FSI-type technology products. So I’d like to say we’ll definitely try to drive the BSI to a better proportion to the marketplace and to our shareholders.

Anafocus Raises 2.5M Euros

Anafocus (Spain) has successfully got new funding totaling 2.5M Euros. The new investment will be used for the acquisition and setup of clean-room facilities for sensor mass-production, the development of a family of off-the-shelf intelligent CMOS image sensors for machine vision, and the expansion of the team and installations in Anafocus’ offices in Spain and Japan.
The funding has been accomplished by Fondo Jeremie Andalucia, a private equity and mezzanine fund managed by the Agency for Innovation and Development of Andalucia. Bullnet Capital, the Spanish venture capital firm that led the Series A round, remains an investor in the company.