Finnish company Specim publishes a nice 2-part video explanation of hyperpectral imaging principles. Like in many popular videos, there are some minor mistakes, but the overall work is still quite good:
Thursday, November 22, 2018
Wednesday, November 21, 2018
Image Sensing Content at ISSCC 2019
ISSCC 2019 to be held on February 17-21 in San Francisco publishes its program with a number of image sensor papers. The image Sensor session starts with Smartsens presentation, probably the first image sensor company from China presenting its work at ISSCC:
A Stacked Global-Shutter CMOS Imager with SC-Type Hybrid-GS Pixel and Self-Knee Point Calibration Single-Frame HDR and On-Chip Binarization Algorithm for Smart Vision Applications
C. Xu, Y. Mo, G. Ren, W. Ma, X. Wang, W. Shi, J. Hou, K. Shao, H. Wang, P. Xiao, Z. Shao, X. Xie, X. Wang, C. Yiu
SmartSens Technology
Energy-Efficient Low-Noise CMOS Image Sensor with Capacitor Array-Assisted Charge-Injection SAR ADC for Motion-Triggered Low-Power IoT Applications
K. D. Choo, L. Xu, Y. Kim, J-H. Seol, X. Wu, D. Sylvester, D. Blaauw
University of Michigan, Ann Arbor, MI
A Data-Compressive 1.5b/2.75b Log-Gradient QVGA Image Sensor with Multi-Scale Readout for Always-On Object Detection
C. Young, A. Omid-Zohoor, P. Lajevardi, B. Murmann
Stanford University, Stanford, CA; Robert Bosch, Sunnyvale, CA
A 76mW 500fps VGA CMOS Image Sensor with Time-Stretched Single-Slope ADCs Achieving 1.95e- Random Noise
I. Park, C. Park, J. Cheon, Y. Chae,
Yonsei University, Seoul, Korea
Kumoh National Institute of Technology, Gyeongbuk, Korea
Dual-Tap Pipelined-Code-Memory Coded-Exposure-Pixel CMOS Image Sensor for Multi-Exposure Single-Frame Computational Imaging
N. Sarhangnejad, N. Katic, Z. Xia, M. Wei, N. Gusev, G. Dutta, R. Gulve, H. Haim, M. Moreno Garcia, D. Stoppa, K. N. Kutulakos, R. Genov
University of Toronto, Toronto, Canada; Synopsys, Toronto, Canada; Fondazione Bruno Kessler, Trento, Italy; ams AG, Ruschlikon, Switzerland
A 400×400-Pixel 6μm-Pitch Vertical Avalanche Photodiodes CMOS Image Sensor Based on 150ps-Fast Capacitive Relaxation Quenching in Geiger Mode for Synthesis of Arbitrary Gain Images
Y. Hirose, S. Koyama, T. Okino, A. Inoue, S. Saito, Y. Nose, M. Ishii, S. Yamahira, S. Kasuga, M. Mori, T. Kabe, K. Nakanishi, M. Usuda, A. Odagawa, T. Tanaka
Panasonic, Nagaokakyo, Japan
A 256×256 40nm/90nm CMOS 3D-Stacked 120dB-Dynamic-Range Reconfigurable Time-Resolved SPAD Imager
R. K. Henderson, N. Johnston, S. W. Hutchings, I. Gyongy, T. Al Abbas, N. Dutton, M. Tyler, S. Chan, J. Leach
University of Edinburgh, Edinburgh, United Kingdom; STMicroelectronics, Edinburgh, United Kingdom; Heriot-Watt University, Edinburgh, United Kingdom
A 32×32-Pixel 0.9THz Imager with Pixel-Parallel 12b VCO-Based ADC in 0.18μm CMOS
S. Yokoyama, M. Ikebe, Y. Kanazawa, T. Ikegami, P. Ambalathankandy, S. Hiramatsu, E. Sano, Y. Takida, H. Minamide
Hokkaido University, Sapporo, Japan; RIKEN, Sendai, Japan
A 512-Pixel 3kHz-Frame-Rate Dual-Shank Lensless Filterless Single- Photon-Avalanche-Diode CMOS Neural Imaging Probe
C. Lee, A. J. Taal, J. Choi, K. Kim, K. Tien, L. Moreaux, M. L. Roukes, K. L. Shepard
Columbia University, New York, NY; KIST, Seoul, Korea; California Institute of Technology, Pasadena
The Industry Showcase event includes:
A Stacked Global-Shutter CMOS Imager with SC-Type Hybrid-GS Pixel and Self-Knee Point Calibration Single-Frame HDR and On-Chip Binarization Algorithm for Smart Vision Applications
C. Xu, Y. Mo, G. Ren, W. Ma, X. Wang, W. Shi, J. Hou, K. Shao, H. Wang, P. Xiao, Z. Shao, X. Xie, X. Wang, C. Yiu
SmartSens Technology
Energy-Efficient Low-Noise CMOS Image Sensor with Capacitor Array-Assisted Charge-Injection SAR ADC for Motion-Triggered Low-Power IoT Applications
K. D. Choo, L. Xu, Y. Kim, J-H. Seol, X. Wu, D. Sylvester, D. Blaauw
University of Michigan, Ann Arbor, MI
A Data-Compressive 1.5b/2.75b Log-Gradient QVGA Image Sensor with Multi-Scale Readout for Always-On Object Detection
C. Young, A. Omid-Zohoor, P. Lajevardi, B. Murmann
Stanford University, Stanford, CA; Robert Bosch, Sunnyvale, CA
A 76mW 500fps VGA CMOS Image Sensor with Time-Stretched Single-Slope ADCs Achieving 1.95e- Random Noise
I. Park, C. Park, J. Cheon, Y. Chae,
Yonsei University, Seoul, Korea
Kumoh National Institute of Technology, Gyeongbuk, Korea
Dual-Tap Pipelined-Code-Memory Coded-Exposure-Pixel CMOS Image Sensor for Multi-Exposure Single-Frame Computational Imaging
N. Sarhangnejad, N. Katic, Z. Xia, M. Wei, N. Gusev, G. Dutta, R. Gulve, H. Haim, M. Moreno Garcia, D. Stoppa, K. N. Kutulakos, R. Genov
University of Toronto, Toronto, Canada; Synopsys, Toronto, Canada; Fondazione Bruno Kessler, Trento, Italy; ams AG, Ruschlikon, Switzerland
A 400×400-Pixel 6μm-Pitch Vertical Avalanche Photodiodes CMOS Image Sensor Based on 150ps-Fast Capacitive Relaxation Quenching in Geiger Mode for Synthesis of Arbitrary Gain Images
Y. Hirose, S. Koyama, T. Okino, A. Inoue, S. Saito, Y. Nose, M. Ishii, S. Yamahira, S. Kasuga, M. Mori, T. Kabe, K. Nakanishi, M. Usuda, A. Odagawa, T. Tanaka
Panasonic, Nagaokakyo, Japan
A 256×256 40nm/90nm CMOS 3D-Stacked 120dB-Dynamic-Range Reconfigurable Time-Resolved SPAD Imager
R. K. Henderson, N. Johnston, S. W. Hutchings, I. Gyongy, T. Al Abbas, N. Dutton, M. Tyler, S. Chan, J. Leach
University of Edinburgh, Edinburgh, United Kingdom; STMicroelectronics, Edinburgh, United Kingdom; Heriot-Watt University, Edinburgh, United Kingdom
A 32×32-Pixel 0.9THz Imager with Pixel-Parallel 12b VCO-Based ADC in 0.18μm CMOS
S. Yokoyama, M. Ikebe, Y. Kanazawa, T. Ikegami, P. Ambalathankandy, S. Hiramatsu, E. Sano, Y. Takida, H. Minamide
Hokkaido University, Sapporo, Japan; RIKEN, Sendai, Japan
A 512-Pixel 3kHz-Frame-Rate Dual-Shank Lensless Filterless Single- Photon-Avalanche-Diode CMOS Neural Imaging Probe
C. Lee, A. J. Taal, J. Choi, K. Kim, K. Tien, L. Moreaux, M. L. Roukes, K. L. Shepard
Columbia University, New York, NY; KIST, Seoul, Korea; California Institute of Technology, Pasadena
The Industry Showcase event includes:
- ams AG, Premstätten, Austria, Direct Time-of-Flight Module in CMOS 55nm HV for Mobile Applications
- Ouster, San Francisco, CA, Native camera imaging on LiDAR and deep learning enablement
- Samsung Electronics, Hwaseong, Korea, Motion Artifact Free Dynamic Vision Sensor for Machine Vision
Automotive Gesture Recognition Market
GlobeNewswire: Global Market Insights forecasts that automotive gesture recognition market will grow at about 44% CAGR from 2018 to 2024 led by rising trend towards customer comfort and advanced driving experience. The market is expected to reach $13.6bn by 2024 from $1bn in 2017:
Event-Based Sensor Use Case
Neuro Vision spin-off from Zurich University Institut de la Vision, Paris, shows a use case for an event-based camera:
Aeye LiDAR Shows 1000m Track Detection, Raises $40m
Techchrunch, Optics.org, VentureBeat: AEye raises a $40m in Series B. round led by Taiwania Capital, the investment firm created and backed by Taiwan’s National Development Council, and includes returning investors Kleiner Perkins, Intel Capital, Airbus Ventures and Tychee Partners.
This brings the LiDAR startup’s total funding to about $61m. In the announcement, founder and CEO Luis Dussan said Taiwania’s investment is a strategic one and will give AEye more access to manufacturing, logistics and tech resources in Asia. AEye also plans to launch a new product at CES in January.
In tests monitored and validated by VSI Labs, a research company that focuses on autonomous-vehicle technology, AEye said that its iDAR sensor, which combines a solid-state lidar and high-resolution camera in one device, was able to detect and track a white color moving truck from one kilometer away. AEye claims that this is four to five times the distance other current lidar systems can detect.
In a press statement, AEye chief of staff Blair LaCorte said the company believes iDAR can potentially track moving objects, including trucks and drones, from 5km to 10km away.
This brings the LiDAR startup’s total funding to about $61m. In the announcement, founder and CEO Luis Dussan said Taiwania’s investment is a strategic one and will give AEye more access to manufacturing, logistics and tech resources in Asia. AEye also plans to launch a new product at CES in January.
In tests monitored and validated by VSI Labs, a research company that focuses on autonomous-vehicle technology, AEye said that its iDAR sensor, which combines a solid-state lidar and high-resolution camera in one device, was able to detect and track a white color moving truck from one kilometer away. AEye claims that this is four to five times the distance other current lidar systems can detect.
In a press statement, AEye chief of staff Blair LaCorte said the company believes iDAR can potentially track moving objects, including trucks and drones, from 5km to 10km away.
Tuesday, November 20, 2018
Sony Adds Some Data on its DSLR/ILC Sensors
Sony publishes flyers for 8 new products for DSLR/ILC cameras spanning from 150MP medium format IMX411 to 20MP 60fps MFT IMX272 sensors, including full-frame and APS-C sensors:
IWISS2018 Posters List
4th International Workshop on Image Sensors and Imaging Systems (IWISS2018) to be held on Nov. 28-29 in Tokyo, publishes the list of posters:
| (1) | ||
| (2) | ||
| (3) | [Poster Presentation] CMOS Image Sensor with Pseudorandom Pixel Placement For Jaggy Elmination | |
| (4) | ||
| (5) | [Poster Presentation] [Poster Presentation] On a BSI Image Signal Accumulation Sensor of 100 Mfps | |
| (6) | ||
| (7) | ||
| (8) | [Poster Presentation] Visualization of time-of-flight signals with normalized and calibrated phasor plot | |
| (9) | [Poster Presentation] A real-time stress monitoring system using a high sensitivity camera | |
| (10) | [Poster Presentation] A low noise global shutter CMOS image sensor with multiple sampling | |
| (11) | ||
| (12) | ||
| (13) | ||
| (14) | ||
| (15) | [Poster Presentation] A high-sensitivity CMOS image sensor with front-side inner-lens | |
| (16) | [Poster Presentation] [Poster Presentation] Lensless imaging by coded image sensors | |
| (17) | ||
| (18) | ||
| (19) | ||
| (20) | ||
| (21) | ||
| (22) |
Monday, November 19, 2018
Dual-Gate Organic Phototransistor for Image Sensing
Nature publishes a paper "Dual-gate organic phototransistor with high-gain and linear photoresponse" Philip C. Y. Chow, Naoji Matsuhisa, Peter Zalar, Mari Koizumi, Tomoyuki Yokota, and Takao Someya from Hong Kong University of Science and Technology, Holst Centre (The Netherlands), and University of Tokyo.
"The conversion of light into electrical signal in a photodetector is a crucial process for a wide range of technological applications. Here we report a new device concept of dual-gate phototransistor that combines the operation of photodiodes and phototransistors to simultaneously enable high-gain and linear photoresponse without requiring external circuitry. In an oppositely biased, dual-gate transistor based on a solution-processed organic heterojunction layer, we find that the presence of both n- and p-type channels enables both photogenerated electrons and holes to efficiently separate and transport in the same semiconducting layer. This operation enables effective control of trap carrier density that leads to linear photoresponse with high photoconductive gain and a significant reduction of electrical noise. As we demonstrate using a large-area, 8 × 8 imaging array of dual-gate phototransistors, this device concept is promising for high-performance and scalable photodetectors with tunable dynamic range."
"The conversion of light into electrical signal in a photodetector is a crucial process for a wide range of technological applications. Here we report a new device concept of dual-gate phototransistor that combines the operation of photodiodes and phototransistors to simultaneously enable high-gain and linear photoresponse without requiring external circuitry. In an oppositely biased, dual-gate transistor based on a solution-processed organic heterojunction layer, we find that the presence of both n- and p-type channels enables both photogenerated electrons and holes to efficiently separate and transport in the same semiconducting layer. This operation enables effective control of trap carrier density that leads to linear photoresponse with high photoconductive gain and a significant reduction of electrical noise. As we demonstrate using a large-area, 8 × 8 imaging array of dual-gate phototransistors, this device concept is promising for high-performance and scalable photodetectors with tunable dynamic range."
Human Eye Resolution in Megapixels
Quora publishes an answer on human eye resolution question written by Michael Bross, former Pychology Professor at Concordia University, Montreal, among 93 other answers. Few interesting quotes:
"...if you look of what is going on in the eye it looks messy, the ‘seeing’ is done by the visual cortex.
Note that the light has to pass trough several structures before it gets to the retina, cornea, aqueous humor, lens, vitreous humor (humors are a translucent gel/watery like medium), blood vessels, and then it has to traverse 4 layers of nerve cells before it gets to the light receptors (rods and cones) at the back of the retina.
So plenty of photons get absorbed before reaching the receptors, add to this that quite a few of them will be bouncing around in the eye ball, and it has been estimated that only around 20–25% of light entering the eye reaches the receptors.
So to put that into pixel estimates (I’m relying here on data from Hendrik Lensch at the Max Plank Institute Informatik), given a 19″ LED viewed at 60 cm. without hyperacuity the visual cortex would process Pixel 3,000x3,000 pixels, with hyperacuity 18,000x18,000."
"...if you look of what is going on in the eye it looks messy, the ‘seeing’ is done by the visual cortex.
Note that the light has to pass trough several structures before it gets to the retina, cornea, aqueous humor, lens, vitreous humor (humors are a translucent gel/watery like medium), blood vessels, and then it has to traverse 4 layers of nerve cells before it gets to the light receptors (rods and cones) at the back of the retina.
So plenty of photons get absorbed before reaching the receptors, add to this that quite a few of them will be bouncing around in the eye ball, and it has been estimated that only around 20–25% of light entering the eye reaches the receptors.
So to put that into pixel estimates (I’m relying here on data from Hendrik Lensch at the Max Plank Institute Informatik), given a 19″ LED viewed at 60 cm. without hyperacuity the visual cortex would process Pixel 3,000x3,000 pixels, with hyperacuity 18,000x18,000."
Sunday, November 18, 2018
High Photon Throughput SPAD Imager
MDPI Special Issue The International SPAD Sensor Workshop publishes a paper "A CMOS SPAD Imager with Collision Detection and 128 Dynamically Reallocating TDCs for Single-Photon Counting and 3D Time-of-Flight Imaging" by Chao Zhang, Scott Lindner, Ivan Michel Antolovic, Martin Wolf, and Edoardo Charbon from Delft University of Technology, University of Zurich, EPFL, and Kavli Institute of Nanoscience.
"Per-pixel time-to-digital converter (TDC) architectures have been exploited by single-photon avalanche diode (SPAD) sensors to achieve high photon throughput, but at the expense of fill factor, pixel pitch and readout efficiency. In contrast, TDC sharing architecture usually features high fill factor at small pixel pitch and energy efficient event-driven readout. While the photon throughput is not necessarily lower than that of per-pixel TDC architectures, since the throughput is not only decided by the TDC number but also the readout bandwidth. In this paper, a SPAD sensor with 32 × 32 pixels fabricated with a 180 nm CMOS image sensor technology is presented, where dynamically reallocating TDCs were implemented to achieve the same photon throughput as that of per-pixel TDCs. Each 4 TDCs are shared by 32 pixels via a collision detection bus, which enables a fill factor of 28% with a pixel pitch of 28.5 μm. The TDCs were characterized, obtaining the peak-to-peak differential and integral non-linearity of −0.07/+0.08 LSB and −0.38/+0.75 LSB, respectively. The sensor was demonstrated in a scanning light-detection-and-ranging (LiDAR) system equipped with an ultra-low power laser, achieving depth imaging up to 10 m at 6 frames/s with a resolution of 64 × 64 with 50 lux background light."
"Per-pixel time-to-digital converter (TDC) architectures have been exploited by single-photon avalanche diode (SPAD) sensors to achieve high photon throughput, but at the expense of fill factor, pixel pitch and readout efficiency. In contrast, TDC sharing architecture usually features high fill factor at small pixel pitch and energy efficient event-driven readout. While the photon throughput is not necessarily lower than that of per-pixel TDC architectures, since the throughput is not only decided by the TDC number but also the readout bandwidth. In this paper, a SPAD sensor with 32 × 32 pixels fabricated with a 180 nm CMOS image sensor technology is presented, where dynamically reallocating TDCs were implemented to achieve the same photon throughput as that of per-pixel TDCs. Each 4 TDCs are shared by 32 pixels via a collision detection bus, which enables a fill factor of 28% with a pixel pitch of 28.5 μm. The TDCs were characterized, obtaining the peak-to-peak differential and integral non-linearity of −0.07/+0.08 LSB and −0.38/+0.75 LSB, respectively. The sensor was demonstrated in a scanning light-detection-and-ranging (LiDAR) system equipped with an ultra-low power laser, achieving depth imaging up to 10 m at 6 frames/s with a resolution of 64 × 64 with 50 lux background light."
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