Tuesday, September 09, 2008

SUSS Supports BSI Trend

SUSS MicroTec announces world's first production-grade wafer bonder specifically optimized for BSI and 3D-integrated image sensor manufacturing. The bonder is presented at Semicon Taiwan, starting today. The BSI industry seems to wind-up.

The bonder is designed for 300mm wafers, while most of the image sensor production today uses 200mm. This might limit the bonder use in the short term.

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