I've missed this news from almost two weeks ago, thanks to R.C. for sending me this item.
Yahoo: Omnivision announced that Xinping (James) He will resign from his position as COO and from the company's board of directors. Mr. He has decided to resign in order to pursue other interests.
Saturday, January 09, 2010
Column Noise and PTC
A new chapter in Albert Theuwissen's tutorial discusses column noise influence on PTC. Step by step the tutorial becomes the most exhaustive source of PTC knowledge available in open access.
New Tool that simulates CMOS and CCD Image Sensors
I received this PR from Albert Theuwissen. I'm posting it here in full as I'm unable to find any other source of it in the Net:
Image Engineering
Press Release - Issue: 08.01.2010
New Tool that simulates CMOS and CCD Image Sensors
Harvest Imaging bvba, Bree, Belgium managed by Albert Theuwissen and Image Engineering Dietmar Wueller, Frechen, Germany, announce that both companies have signed a cooperation contract to develop a software tool that simulates the behaviour of image sensors. The new tool is intended to help camera manufacturers and system integrators to select the best sensor for their specific application.
Frechen (Germany), the 8th of January 2010. Today Harvest Imaging bvba, Bree, Belgium managed by Albert Theuwissen and Image Engineering Dietmar Wueller, Frechen, Germany, signed a cooperation contract to develop a new software tool. “This tool will be a milestone for manufacturers and system integrators to specify the best sensors for different applications”, so Dietmar Wueller, CEO and CTO of Image Engineering.
The characteristic sensor data like imager geometry, quantum efficiency, dark current, temperature etc. is entered into the simulation. A virtual sensor with these characteristics is created and exposed to virtual photons generating an image captured with that sensor. This kind of simulation generates real images that provide visual information about the impact of specific parameters on the final image quality. Until now selecting a sensor for an application was based on the experience of the system integrator to interpret the technical specs of a sensor. “With the new tool this experience can be converted into images without even having the sensor,” explains Albert Theuwissen, CEO of Harvest Imaging. “This will help engineers to learn faster, to improve the sensor quality by focusing on the right parameters and to find the right sensor much quicker than today.”
Both cooperating companies are confident that an application like this leads to a standardized set of technical specs for all sensors on the market and will both strengthen their efforts to get in this direction.
The new sensor simulation software tool will be available within the next 12 month and sold through Image Engineering and its worldwide reseller network.
About Harvest Imaging bvba
After retirement from DALSA and Philips, Albert Theuwissen founded Harvest Imaging in 2007. The company is focusing on training, teaching, advising and consulting in the field of solid-state imaging systems. Harvest Imaging offers public courses as well as tailored in-house training. In 2010 a new course based on hands-on measurements on commercially available cameras will be introduced. This will be the very first course ever in the field of digital imaging offering the participants hands-on experience. The consulting activities focus on assisting imaging engineers in their daily work: specifying their sensor or camera, designing an imager or camera, evaluation of imagers or cameras, qualification of their system, organizing and chairing technical review meetings, selection of design houses, selection of wafer fabs, etc.
Harvest Imaging is a world leading company in providing technical know-how in the field of digital imaging.
About Image Engineering
Since 1997 Image Engineering is the leading independent testlab for image capture devices in the world, covering still and video devices. On a regular basis Digital Still Cameras are tested for the German photographic magazines Color Foto and c’t as well as for a lot of manufacturers including Fujifilm, Leica, Olympus, Panasonic, Ricoh, Sony. Cell Phone cameras are tested for carriers like Vodafone and numerous cell phone manufacturers. Occasionally camcorders, video cameras, broadcast cameras, and scanners are tested for magazines as well as manufacturers and finally cameras for all kinds of applications like security, automotive, machine vision, and remote sensing have been tested over the past years for various companies. Since 2006 when „Esser Test Charts“ was bought, Image Engineering has become the leading supplier for test equipment in the area of digital capture devices. The majority of the more than 260 different test charts is designed for video and broadcast applications.
Image Engineering is active in a variety of standardization activities among which are ISO TC42 (Photography), SMPTE (Society of Motion Picture and Television Engineers), CPIQ (Cell Phone Image Quality), and EMVA (European Machine Vision Association).
Image Engineering
Press Release - Issue: 08.01.2010
New Tool that simulates CMOS and CCD Image Sensors
Harvest Imaging bvba, Bree, Belgium managed by Albert Theuwissen and Image Engineering Dietmar Wueller, Frechen, Germany, announce that both companies have signed a cooperation contract to develop a software tool that simulates the behaviour of image sensors. The new tool is intended to help camera manufacturers and system integrators to select the best sensor for their specific application.
Frechen (Germany), the 8th of January 2010. Today Harvest Imaging bvba, Bree, Belgium managed by Albert Theuwissen and Image Engineering Dietmar Wueller, Frechen, Germany, signed a cooperation contract to develop a new software tool. “This tool will be a milestone for manufacturers and system integrators to specify the best sensors for different applications”, so Dietmar Wueller, CEO and CTO of Image Engineering.
The characteristic sensor data like imager geometry, quantum efficiency, dark current, temperature etc. is entered into the simulation. A virtual sensor with these characteristics is created and exposed to virtual photons generating an image captured with that sensor. This kind of simulation generates real images that provide visual information about the impact of specific parameters on the final image quality. Until now selecting a sensor for an application was based on the experience of the system integrator to interpret the technical specs of a sensor. “With the new tool this experience can be converted into images without even having the sensor,” explains Albert Theuwissen, CEO of Harvest Imaging. “This will help engineers to learn faster, to improve the sensor quality by focusing on the right parameters and to find the right sensor much quicker than today.”
Both cooperating companies are confident that an application like this leads to a standardized set of technical specs for all sensors on the market and will both strengthen their efforts to get in this direction.
The new sensor simulation software tool will be available within the next 12 month and sold through Image Engineering and its worldwide reseller network.
About Harvest Imaging bvba
After retirement from DALSA and Philips, Albert Theuwissen founded Harvest Imaging in 2007. The company is focusing on training, teaching, advising and consulting in the field of solid-state imaging systems. Harvest Imaging offers public courses as well as tailored in-house training. In 2010 a new course based on hands-on measurements on commercially available cameras will be introduced. This will be the very first course ever in the field of digital imaging offering the participants hands-on experience. The consulting activities focus on assisting imaging engineers in their daily work: specifying their sensor or camera, designing an imager or camera, evaluation of imagers or cameras, qualification of their system, organizing and chairing technical review meetings, selection of design houses, selection of wafer fabs, etc.
Harvest Imaging is a world leading company in providing technical know-how in the field of digital imaging.
About Image Engineering
Since 1997 Image Engineering is the leading independent testlab for image capture devices in the world, covering still and video devices. On a regular basis Digital Still Cameras are tested for the German photographic magazines Color Foto and c’t as well as for a lot of manufacturers including Fujifilm, Leica, Olympus, Panasonic, Ricoh, Sony. Cell Phone cameras are tested for carriers like Vodafone and numerous cell phone manufacturers. Occasionally camcorders, video cameras, broadcast cameras, and scanners are tested for magazines as well as manufacturers and finally cameras for all kinds of applications like security, automotive, machine vision, and remote sensing have been tested over the past years for various companies. Since 2006 when „Esser Test Charts“ was bought, Image Engineering has become the leading supplier for test equipment in the area of digital capture devices. The majority of the more than 260 different test charts is designed for video and broadcast applications.
Image Engineering is active in a variety of standardization activities among which are ISO TC42 (Photography), SMPTE (Society of Motion Picture and Television Engineers), CPIQ (Cell Phone Image Quality), and EMVA (European Machine Vision Association).
Friday, January 08, 2010
Tessera Talks about TSV Reliability
IEEE CPMT Society presents "High-Reliability Through-Silicon Via (TSV) Solutions for Image Sensor Packaging" lecture by Belgacem Haba, Fellow and Chief Technology Officer, Interconnect, Components & Materials (ICM), Tessera on January 13, 2010 in Santa Clara, CA.
"In 2009, the industry shipped 2.5 billion image sensor units with an average selling price of $5 – providing a total addressable market of $12B. This presentation will discuss image sensor and camera module trends and growth. It will trace the growing movement in the image sensor market from chip-on-board to wafer-level packaging for cost savings and other advantages. It also will trace the image sensor evolution toward wafer-level packaging and introduce TSV wafer-level chip-scale packaging, and how to address the barriers to adoption with a new approach."
"In 2009, the industry shipped 2.5 billion image sensor units with an average selling price of $5 – providing a total addressable market of $12B. This presentation will discuss image sensor and camera module trends and growth. It will trace the growing movement in the image sensor market from chip-on-board to wafer-level packaging for cost savings and other advantages. It also will trace the image sensor evolution toward wafer-level packaging and introduce TSV wafer-level chip-scale packaging, and how to address the barriers to adoption with a new approach."
Thursday, January 07, 2010
BSI Sensors in Sony, Samsung, Casio, JVC Cameras
Sony has expanded its BSI sensor range. As Camcorderinfo.com reports, the new HDR-XR350V, HDR-CX350V, and HDR-CX300 mid-range video cameras feature 2.65MP 1/4-inch BSI illuminated sensors. This roughly translates to 1.75um pixel size, same as in 6.6MP 1/2.9-inch sensor announced a year ago.
So, for now Sony appears to have 3 different BSI sensors, all based on 1.75um pixels: two for camcorders (consumer high-end 6.6MP and mid-range 2.6MP) and one 10.1MP for DSCs.
The 10.1MP BSI sensor debuted in 2009 Sony DSC models and also used in this year's HX5 and TX7 cameras (dpreview.com). Casio appears to utilize the same BSI sensor in the new EX-FH100 high-end DSC. For Casio this is the first BSI-enabled camera.
Another new BSI sensor appears in Samsung camcorder line (camcorderinfo.com). The 10.1MP 1/2.33-inch sensor appears in HMX-S10, HMX-S15, and HMX-S16 video cameras representing the company's top range.
While we are at backside-sensing camcorders, it's worth noting that JVC has announced its first BSI model GZ-HD620 for Japanese market about a month ago. One could expect a worldwide launch at this year CES, but this has not happened yet. JVC sensor is 1/4.1-inch, 3.32MP, based on 1.75um pixels like others.
Update: JVC announced a line of BSI sensor equipped camcorders for North American market: flagship GZ-HM1, mid-range GZ-HM550, both based on 1/2.3-inch 10.62MP sensor and the previously announced in Japan GZ-HD620 based on 1/4.1-inch 3.32MP sensor.
So, for now Sony appears to have 3 different BSI sensors, all based on 1.75um pixels: two for camcorders (consumer high-end 6.6MP and mid-range 2.6MP) and one 10.1MP for DSCs.
The 10.1MP BSI sensor debuted in 2009 Sony DSC models and also used in this year's HX5 and TX7 cameras (dpreview.com). Casio appears to utilize the same BSI sensor in the new EX-FH100 high-end DSC. For Casio this is the first BSI-enabled camera.
Another new BSI sensor appears in Samsung camcorder line (camcorderinfo.com). The 10.1MP 1/2.33-inch sensor appears in HMX-S10, HMX-S15, and HMX-S16 video cameras representing the company's top range.
While we are at backside-sensing camcorders, it's worth noting that JVC has announced its first BSI model GZ-HD620 for Japanese market about a month ago. One could expect a worldwide launch at this year CES, but this has not happened yet. JVC sensor is 1/4.1-inch, 3.32MP, based on 1.75um pixels like others.
Update: JVC announced a line of BSI sensor equipped camcorders for North American market: flagship GZ-HM1, mid-range GZ-HM550, both based on 1/2.3-inch 10.62MP sensor and the previously announced in Japan GZ-HD620 based on 1/4.1-inch 3.32MP sensor.
Wednesday, January 06, 2010
Omnivision Announces 720p HD Video BSI Sensor, VGA Cameracube
Yahoo: Omnivision announced OV9726 - a native HD video sensor built on 1.75um BSI pixel technology. The 1/6-inch OV9726 delivers 720p HD video at 30fps and targets cameras in notebooks, netbooks, webcams, mobile phones, PMPs and other mobile entertainment devices. The pixel sensitivity is reported to be 1,480 mV/lux-sec.
OmniVision has already secured design wins from top tier customers for the OV9726. The OV9726 is currently available for sampling, and is expected to enter mass production in Q1 2010.
Yahoo: Another addition to Omivision sensor portfolio is OVM7692 VGA CameraCube. The sensor's compact size (2.8 x 3.2 x 2.5 mm) is said to be among the smallest VGA modules in the industry. The OVM7692 is a complete VGA camera solution including parallel and MIPI output interfaces, automatic luminance detection and an integrated EMI solution.
OmniVision says it has already secured design wins for the OVM7692. The sensor is currently sampling and has been released to go into volume production.
OmniVision has already secured design wins from top tier customers for the OV9726. The OV9726 is currently available for sampling, and is expected to enter mass production in Q1 2010.
Yahoo: Another addition to Omivision sensor portfolio is OVM7692 VGA CameraCube. The sensor's compact size (2.8 x 3.2 x 2.5 mm) is said to be among the smallest VGA modules in the industry. The OVM7692 is a complete VGA camera solution including parallel and MIPI output interfaces, automatic luminance detection and an integrated EMI solution.
OmniVision says it has already secured design wins for the OVM7692. The sensor is currently sampling and has been released to go into volume production.
Tuesday, January 05, 2010
Aptina Applies for EDoF Patent
Aptina's EDoF patent application US20090297056 was published on Dec. 3, 2009:
Method and Apparatus for Extended Depth-of-Field Image Restoration
Lelescu, Dan (Morgan Hill, CA, US)
Mullis, Robert (Soquel, CA, US)
Rao, Pravin (San Jose, CA, US)
Venkataraman, Kartik (San Jose, CA, US)
Lu, Cheng (Santa Clara, CA, US)
Chen, Junqing (San Jose, CA, US)
Filed: 05/28/2008
Primarily algorithmic-based application talks about trade-offs between a quality of focusing and a depth of focus.
Aptina's EDoF approach is also presented in SPIE conference paper.
As a side note, two of the inventors - Kartik Venkataraman and Robert Mullis left Micron in March 2008 to found Pelican Imaging together with Aman Jabbi, a former Head of video technologies at Micron. They were able to raise $7M in round A financing in August 2009 - quite an achievement these days.
The new company is developing "computational cameras that can manipulate static, 2D images through three dimensions". The company site says: "At Pelican Imaging, we introduce a fundamental shift towards "software cameras" and address the challenges posed by conventional camera design, small pixels and the megapixel race. Pelican's technology will result in superior photographs & video, with new and exciting features and applications."
Method and Apparatus for Extended Depth-of-Field Image Restoration
Lelescu, Dan (Morgan Hill, CA, US)
Mullis, Robert (Soquel, CA, US)
Rao, Pravin (San Jose, CA, US)
Venkataraman, Kartik (San Jose, CA, US)
Lu, Cheng (Santa Clara, CA, US)
Chen, Junqing (San Jose, CA, US)
Filed: 05/28/2008
Primarily algorithmic-based application talks about trade-offs between a quality of focusing and a depth of focus.
Aptina's EDoF approach is also presented in SPIE conference paper.
As a side note, two of the inventors - Kartik Venkataraman and Robert Mullis left Micron in March 2008 to found Pelican Imaging together with Aman Jabbi, a former Head of video technologies at Micron. They were able to raise $7M in round A financing in August 2009 - quite an achievement these days.
The new company is developing "computational cameras that can manipulate static, 2D images through three dimensions". The company site says: "At Pelican Imaging, we introduce a fundamental shift towards "software cameras" and address the challenges posed by conventional camera design, small pixels and the megapixel race. Pelican's technology will result in superior photographs & video, with new and exciting features and applications."
Monday, January 04, 2010
Varioptic Announces Licensing Deal with Cognex
2 months ago Varioptic announced that Cognex will use its liquid lens in AF-enable ID readers. Now Cognex and Varioptic signed a licensing deal and partnership. Varioptic lenses are said to be in production with CSI at its Wuxi, China plant since January 2007 and also more recently, in mass production, with Japanese Seiko Instruments.
Omnivision Launches 14.6MP 1080p/60fps BSI Sensors
Yahoo: The new OV14810 and OV14825 sensors are based on 1.4um BSI pixels and have 4,416 x 3,312 active array size. The sensor's speed is 15fps at full resolution, or 60fps in 1080p HD video mode using binning and providing some margins for electronic image stabilization. OV14810 is targeted to digital still/video cameras, while OV14825 is intended for mobile applications.
The OV14810 and OV14825 are sampling now with reference platforms available, and will enter mass production in Q2 2010.
The OV14810 and OV14825 are sampling now with reference platforms available, and will enter mass production in Q2 2010.
Pixart Ships VGA Sensor for Mediatek Reference Design
Digitimes: Pixart enters mobile sensor market with VGA sensor for MediaTek 62-series handset reference design, according to the newspaper's sources. The sensors are shipped to Compal and Arima and manufactured at UMC 8-inch fab. The sensors are packaged with XinTec's chip on glass (COS) bonding technology.
Pixart is expected to ship 2-3 million sensors per month in 2010. The shipments are likely to jump to 5 million units per month in 2011, according to Digitimes' sources. The margins are said to be low, so these products only account for a single-digit share of Pixart's total revenues.
Pixart is expected to ship 2-3 million sensors per month in 2010. The shipments are likely to jump to 5 million units per month in 2011, according to Digitimes' sources. The margins are said to be low, so these products only account for a single-digit share of Pixart's total revenues.
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