Friday, January 08, 2010

Tessera Talks about TSV Reliability

IEEE CPMT Society presents "High-Reliability Through-Silicon Via (TSV) Solutions for Image Sensor Packaging" lecture by Belgacem Haba, Fellow and Chief Technology Officer, Interconnect, Components & Materials (ICM), Tessera on January 13, 2010 in Santa Clara, CA.

"In 2009, the industry shipped 2.5 billion image sensor units with an average selling price of $5 – providing a total addressable market of $12B. This presentation will discuss image sensor and camera module trends and growth. It will trace the growing movement in the image sensor market from chip-on-board to wafer-level packaging for cost savings and other advantages. It also will trace the image sensor evolution toward wafer-level packaging and introduce TSV wafer-level chip-scale packaging, and how to address the barriers to adoption with a new approach."


  1. Hi

    I would like to ask you whether you would be interested in writing something about an upcoming IntertechPira Image Sensors Europe 2010 conference. You can find out more about it on

    Also, I would like to offer you a free place at this event in return for mentioning this event.

    If you want to discuss this further, please contact me on

    I hope to hear from you
    Best regards

  2. Interesting to see how you can get free access to the conference ! Others have to pay an incredible amount of money to attend.

  3. It is well deserved. This site is a unique resource that keeps readers up-to-date on what is going on in image sensors world.

  4. Veronika, I'd gladly publish the information about the conference. But so far you do not have the program on your site, do you?

    As for you kind free offer, unfortunately I won't be able to attend this year. Thank you anyway!

  5. ISW blogger should ask for $10K for mentioning the conference on this blog. That's what it's worth... Intertech is getting away cheap by offering a free ticket.


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