Monday, March 07, 2016
Friday, March 04, 2016
Brillnics Patent Applications Published
Many have been wondering what Junichi Nakamura's startup Brillnics is working on, especially after TSMC pixel group head S.G. Wuu has joined them. Two PCT patent applications might shed some light on it:
WO2016009942: SOLID STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS by TAKAYANAGI, Isao; TANAKA, Shunsuke; MORI, Kazuya; ARIYOSHI, Katsuhiko; MATSUO, Shinichiro.
WO2016009943: SOLID-STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS by AKAYANAGI, Isao; TANAKA, Shunsuke; MORI, Kazuya; ARIYOSHI, Katsuhiko; MATSUO, Shinichiro.
While the detailed description is in Japanese, just from the abstract and figures, it appears to be a stacked sensor built on CMOS pixel with CCD-like charge transfer and storage:
"This solid-state imaging device 100 has: a light sensitive unit that includes pixel units 211, which are disposed in a matrix, and charge forwarding units 212 for forwarding, by the column, the signal charge of the pixel units; a plurality of charge accumulation units 220 that accumulate the signal charges forwarded by the plurality of charge forwarding units of the light sensitive unit; a relay unit 240 that relays the forwarding of the signal charges forwarded by the plurality of charge accumulation units to each charge accumulation unit; an output unit 230 that outputs the signal charges of the plurality of charge accumulation units as electric signals; a first substrate 110 at which the light sensitive unit 210 is formed; and a second substrate 120 at which the charge accumulation unit 220 and output unit 230 are formed. The first substrate and second substrate are laminated together, and the relay unit 240 electrically couples the charge forwarding unit of the first substrate to the charge accumulation unit of the second substrate by means of a connection section traversing the substrates outside the light sensitive region of the light sensitive unit."
The most interesting part is a charge transfer between the stacked dies through TSV:
WO2016009942: SOLID STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS by TAKAYANAGI, Isao; TANAKA, Shunsuke; MORI, Kazuya; ARIYOSHI, Katsuhiko; MATSUO, Shinichiro.
WO2016009943: SOLID-STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS by AKAYANAGI, Isao; TANAKA, Shunsuke; MORI, Kazuya; ARIYOSHI, Katsuhiko; MATSUO, Shinichiro.
While the detailed description is in Japanese, just from the abstract and figures, it appears to be a stacked sensor built on CMOS pixel with CCD-like charge transfer and storage:
"This solid-state imaging device 100 has: a light sensitive unit that includes pixel units 211, which are disposed in a matrix, and charge forwarding units 212 for forwarding, by the column, the signal charge of the pixel units; a plurality of charge accumulation units 220 that accumulate the signal charges forwarded by the plurality of charge forwarding units of the light sensitive unit; a relay unit 240 that relays the forwarding of the signal charges forwarded by the plurality of charge accumulation units to each charge accumulation unit; an output unit 230 that outputs the signal charges of the plurality of charge accumulation units as electric signals; a first substrate 110 at which the light sensitive unit 210 is formed; and a second substrate 120 at which the charge accumulation unit 220 and output unit 230 are formed. The first substrate and second substrate are laminated together, and the relay unit 240 electrically couples the charge forwarding unit of the first substrate to the charge accumulation unit of the second substrate by means of a connection section traversing the substrates outside the light sensitive region of the light sensitive unit."
The most interesting part is a charge transfer between the stacked dies through TSV:
Samsung Galaxy S7 Dual Pixel AF Sourced from Sony
Chipworks reverse engineering of Samsung Galaxy S7 Edge smartphone confirms the rumors that its 12MP, 1.4um dual pixel AF sensor is Sony IMX260:
"Our lab staff have removed the imaging chip from the 12 MP camera module and have found a Sony back-illuminated (Exmor R) CMOS image sensor. We were expecting to find TSV arrays around the periphery of the active pixel array, corresponding to Sony’s stacked chip (Exmor RS) technology platform. Sony hasn’t publicly announced the IMX260, but based on what we’ve been reading, we assume that is the part number. It’s a bit of a surprise that the IMX260 isn’t an Exmor RS sensor, as we’ve been documenting a lot of Sony design wins based on its 1st and 2nd generation Exmor RS technology. It seems the full chip PDAF functionality, which requires dual readout from each pixel, was implemented with a multi-chip solution rather than a stacked (CIS + ISP) solution.
The Sony IMX260 die size, as measured from the die seals, is 6.69 mm x 5.55 mm (37.1 mm2). There are no conventional die identification markings in use on the die, consistent with back-illuminated (stacked/non-stacked) Sony CIS chips. We confirmed a pixel pitch of 1.4 µm and a Bayer-patterned color filter array."
The 5MP front camera is based on 1.34um BSI pixel Samsung S5K4E6XP sensor:
Cnet's Youtube video shows Samsung Galaxy S7 camera presentation at MWC 2016:
"Our lab staff have removed the imaging chip from the 12 MP camera module and have found a Sony back-illuminated (Exmor R) CMOS image sensor. We were expecting to find TSV arrays around the periphery of the active pixel array, corresponding to Sony’s stacked chip (Exmor RS) technology platform. Sony hasn’t publicly announced the IMX260, but based on what we’ve been reading, we assume that is the part number. It’s a bit of a surprise that the IMX260 isn’t an Exmor RS sensor, as we’ve been documenting a lot of Sony design wins based on its 1st and 2nd generation Exmor RS technology. It seems the full chip PDAF functionality, which requires dual readout from each pixel, was implemented with a multi-chip solution rather than a stacked (CIS + ISP) solution.
The Sony IMX260 die size, as measured from the die seals, is 6.69 mm x 5.55 mm (37.1 mm2). There are no conventional die identification markings in use on the die, consistent with back-illuminated (stacked/non-stacked) Sony CIS chips. We confirmed a pixel pitch of 1.4 µm and a Bayer-patterned color filter array."
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| X-Ray image |
The 5MP front camera is based on 1.34um BSI pixel Samsung S5K4E6XP sensor:
Cnet's Youtube video shows Samsung Galaxy S7 camera presentation at MWC 2016:
Thursday, March 03, 2016
Scanning Microwave Impedance Microscopy
Chipworks says that scanning microwave impedance microscopy (sMIM), a new scanning probe microscopy (SPM) technique, might replace traditional scanning capacitance microscopy (SCM). Like SCM, the new sMIM technique reveals information on the implanted dopant structures of a semiconductor device.
Chipworks publishes cross-sectional and plan-view images of the pixels of the OmniVision OV2D7AG, which is a 175 kilo-pixel, FSI global shutter, infrared CMOS sensor from the Amazon Fire Phone:
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| sMIM Hardware Simplified Schematic Diagram |
Chipworks publishes cross-sectional and plan-view images of the pixels of the OmniVision OV2D7AG, which is a 175 kilo-pixel, FSI global shutter, infrared CMOS sensor from the Amazon Fire Phone:
AR Fundraising News
PRNewswire: Deep Optics has raised $4M in a Series A financing round to fund the development of its image sensor-equipped glasses. The round includes strategic investor Essilor, the world leader in ophthalmic optics, Taiwan-based Atomics 14 Ventures and several private investors.
"The human eye has a natural focusing ability that degrades with age. Current multifocal glasses compensate for this degradation, but they cannot offer adaptable correction power management. The dynamic solution we're developing is actually similar to the human focusing mechanism, and so in addition to its superior lens function, should be even easier to get used to with minimal, if any, adjustment required," explained Yariv Haddad, co-founder and CEO of Deep Optics.
Deep Optics is also exploring additional applications for its adaptive electronic lens technology. Two notable applications are AR and VR systems, which are likely to benefit from the addition of adaptive optics to future models. According to Haddad, Deep Optics has already started discussions with companies in this field.
PRNewswire, GlobeNewsWire: Meanwhile, the stealth AR startup Magic Leap raises $793.5M in what might be the largest C round in Internet history. The new funding will give Magic Leap a post-money value of $4.5 billion. (Wired)
"Here at Magic Leap we are creating a new world where digital and physical realities seamlessly blend together to enable amazing new experiences. This investment will accelerate bringing our new Mixed Reality Lightfield™ experience to everyone," said Rony Abovitz, Founder, President, and CEO of Magic Leap, Inc. "We are excited to welcome Alibaba as a strategic partner to help introduce Magic Leap's breakthrough products to the over 400 million people on Alibaba's platforms."
"The human eye has a natural focusing ability that degrades with age. Current multifocal glasses compensate for this degradation, but they cannot offer adaptable correction power management. The dynamic solution we're developing is actually similar to the human focusing mechanism, and so in addition to its superior lens function, should be even easier to get used to with minimal, if any, adjustment required," explained Yariv Haddad, co-founder and CEO of Deep Optics.
Deep Optics is also exploring additional applications for its adaptive electronic lens technology. Two notable applications are AR and VR systems, which are likely to benefit from the addition of adaptive optics to future models. According to Haddad, Deep Optics has already started discussions with companies in this field.
PRNewswire, GlobeNewsWire: Meanwhile, the stealth AR startup Magic Leap raises $793.5M in what might be the largest C round in Internet history. The new funding will give Magic Leap a post-money value of $4.5 billion. (Wired)
"Here at Magic Leap we are creating a new world where digital and physical realities seamlessly blend together to enable amazing new experiences. This investment will accelerate bringing our new Mixed Reality Lightfield™ experience to everyone," said Rony Abovitz, Founder, President, and CEO of Magic Leap, Inc. "We are excited to welcome Alibaba as a strategic partner to help introduce Magic Leap's breakthrough products to the over 400 million people on Alibaba's platforms."
Wednesday, March 02, 2016
Sony Introduces SNR1s Performance Index
Sony introduces SNR1s [lx] as an index used to quantitatively evaluate picture quality at low illumination. SNR1s [lx] is a proprietary index advocated by Sony, and is limited to CMOS image sensors for security camera applications. A smaller value indicates better picture quality at low illumination. SNR1s [lx] is an acronym consisting of "SNR" (Signal-to-Noise Ratio), "1" (represents that the signal level when noise = 1 is 1), and "s" (for Security).
SNR1s measurement:
Two 3200 [K] light sources illuminate an 18% gray chart from different directions, and dimming is performed to 100 [lx]. A camera is placed so that the distance from the gray chart to the imaging surface of the image sensor is 1 m, the sensitivity [e-] and dark noise [e-] are measured, and SNR1s [lx] is calculated using the relational equation (1). The luminance when equation (1) equals 1 is SNR1s [lx].
SNR1s Values of Sony CMOS Sensors for Security Applications:
SNR1s measurement:
Two 3200 [K] light sources illuminate an 18% gray chart from different directions, and dimming is performed to 100 [lx]. A camera is placed so that the distance from the gray chart to the imaging surface of the image sensor is 1 m, the sensitivity [e-] and dark noise [e-] are measured, and SNR1s [lx] is calculated using the relational equation (1). The luminance when equation (1) equals 1 is SNR1s [lx].
SNR1s Values of Sony CMOS Sensors for Security Applications:
Tuesday, March 01, 2016
Toshiba Announces ADAS Processor for Monocular Cameras
PRNewswire, BusinessWire: Toshiba announces the newest addition to its TMPV760 family of image recognition processors for automotive applications. The TMPV7602XBG is suitable for monocular cameras used in ADAS, and will help designers implement ADAS applications utilizing a cost-optimized camera system with a small form factor.
Featuring 13 hardware-based image recognition accelerators, the TMPV7602XBG incorporates ADAS features that will become part of the camera requirements for the European New Car Assessment Program (Euro NCAP) in 2018. These include Autonomous Emergency Braking (AEB), Traffic Signal Recognition (TSR), Lane Departure Warning (LDW) / Lane Keeping Assist (LKA), High Beam Assistance (HBA), and Forward Collision Warning (FCW). In addition, the processor supports such new applications as Traffic Light Recognition (TLR) and night-time pedestrian detection.
ADAS applications are processed concurrently within a typical time window of 50ms inside the image recognition processor and with relatively low power consumption due to the purpose-built hardware accelerators and media processing units. The TMPV7602XBG can process up to five applications concurrently, with very low power consumption, and targets mid- to high-end ADAS designs. Optimizing the circuit to downsize the ADAS monocular camera module enables the device's reduced package size (17mm x 17mm BGA with 521 pins and 0.65mm ball pitch) and an anticipated 50-percent reduction in power consumption.
Samples of the TMPV7602XBG image recognition processor will begin shipping in March. Mass production is scheduled for January 2018.
Featuring 13 hardware-based image recognition accelerators, the TMPV7602XBG incorporates ADAS features that will become part of the camera requirements for the European New Car Assessment Program (Euro NCAP) in 2018. These include Autonomous Emergency Braking (AEB), Traffic Signal Recognition (TSR), Lane Departure Warning (LDW) / Lane Keeping Assist (LKA), High Beam Assistance (HBA), and Forward Collision Warning (FCW). In addition, the processor supports such new applications as Traffic Light Recognition (TLR) and night-time pedestrian detection.
ADAS applications are processed concurrently within a typical time window of 50ms inside the image recognition processor and with relatively low power consumption due to the purpose-built hardware accelerators and media processing units. The TMPV7602XBG can process up to five applications concurrently, with very low power consumption, and targets mid- to high-end ADAS designs. Optimizing the circuit to downsize the ADAS monocular camera module enables the device's reduced package size (17mm x 17mm BGA with 521 pins and 0.65mm ball pitch) and an anticipated 50-percent reduction in power consumption.
Samples of the TMPV7602XBG image recognition processor will begin shipping in March. Mass production is scheduled for January 2018.
Technavio Names Top 5 CMOS Sensor Makers
BusinessWire: According to the latest report by Technavio, the CMOS sensors market is highly fragmented due to the presence of a large number of vendors. Sony is the market leader here followed by Samsung Electronics, OmniVision, Canon, and ON Semiconductor.
Sony
Sony is the market leader with a 27% market share. “The reason behind Sony's success is its strategy of purchasing many factories in order to boost CMOS sensor production to meet the demand for sensors incorporated in the global smartphone market. Their plan was to welcome any smartphone manufacturer to use its CMOS image sensor,” says Sunil Singh, a lead analyst at Technavio for computing devices.
Samsung Electronics
Samsung Electronics is the second major vendor in this market with a market share of 19%.
OmniVision
Omnivision is the third major vendor in this market with 17% market share. OmniVision is mostly driving benefit from the increasing adoption of smartphones in China and India.
Canon
Canon is the fourth major vendor in the CMOS sensors market with a 7% market share. Its strengths are that it always looks for innovation and invests a lot in production to cut costs. Its only weakness is the major competition from its rivals like Nikon, which forces it to invest more in advertisements, and which again indirectly leads to increasing the price of its products.
ON Semiconductor (Aptina)
ON Semiconductor is the fifth major vendor in this market with a market share of 6%. In August 2014, ON Semi acquired Aptina Imaging. In 2012, Aptina had almost an 8% market share in CMOS image sensors, which now belongs to ON Semi.
Sony
Sony is the market leader with a 27% market share. “The reason behind Sony's success is its strategy of purchasing many factories in order to boost CMOS sensor production to meet the demand for sensors incorporated in the global smartphone market. Their plan was to welcome any smartphone manufacturer to use its CMOS image sensor,” says Sunil Singh, a lead analyst at Technavio for computing devices.
Samsung Electronics
Samsung Electronics is the second major vendor in this market with a market share of 19%.
OmniVision
Omnivision is the third major vendor in this market with 17% market share. OmniVision is mostly driving benefit from the increasing adoption of smartphones in China and India.
Canon
Canon is the fourth major vendor in the CMOS sensors market with a 7% market share. Its strengths are that it always looks for innovation and invests a lot in production to cut costs. Its only weakness is the major competition from its rivals like Nikon, which forces it to invest more in advertisements, and which again indirectly leads to increasing the price of its products.
ON Semiconductor (Aptina)
ON Semiconductor is the fifth major vendor in this market with a market share of 6%. In August 2014, ON Semi acquired Aptina Imaging. In 2012, Aptina had almost an 8% market share in CMOS image sensors, which now belongs to ON Semi.
Four Accused of Illegal Export of DALSA Technology to China
Newswire.ca: Royal Canadian Mounted Police (RCMP) has accused four individuals in connection with the illegal export of controlled goods and technologies to China. The investigation, dubbed Project OSensor, commenced in early 2014 after the RCMP was requested to conduct a criminal investigation by Public Services and Procurement Canada – Controlled Goods Directorate and Global Affairs Canada, as a result of a written complaint having been received by them from Teledyne DALSA Inc. Waterloo. The matter involves controlled goods and technologies being shipped between Canada and China in violation of the Canadian Controlled Goods Program and related Export Laws. Police allege that the four accused involved themselves in Chinese contracts for the design and development of Controlled Goods intended for space satellite use. These contracts involved a state-owned corporation and a Chinese based company founded by two of the accused to create microelectronics destined to enhance space satellite camera technology.
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