Tuesday, June 10, 2008

Nextreme Thermal Bump Technology Adopted by Princeton Lightwave

EETAsia: Princeton Lightwave Inc. (PLI) and Nextreme Thermal Solutions Inc. have agreed to co-develop a SWIR focal plane sensor using Nextreme's thermoelectric cooling bumps. The two companies are working on integrating thin-film thermoelectric cooling bumps with InGaAs focal plane arrays to dramatically reduce power consumption and weight, and improve overall performance.

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