Friday, November 14, 2008

Joint Yole-Chipworks Report on Toshiba TSV

The Toshibe VGA sensor ‘Through Silicon Vias’ TSV reverse engineering report, jointly published by Chipworks and Yole Developpement, analyzes the technology and economics behind Toshiba’s latest Image Sensor. The new report features three different chapters presenting a technical analysis by Chipworks and a reverse costing analysis and the TSV market perspectives by Yole.

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