Trading Markets: DxO Labs and Marvell announce a licensing agreement to integrate DxO Labs programmable hardware core and image processing technology into Marvell ARMADA application processors.
"The DxO ISP offers our mobile customers stunning image quality for mobile connected consumer devices like cameras using low cost raw sensors or video cameras and image capture oriented devices", said Hongyi Chen, VP of Engineering, Marvell Processor Group and Application Processor R&D.
"Marvell customers will benefit from DxO Labs image quality but they can also differentiate their products by using optional software add-ons from DxO Labs such as extended depth of field (DxO DOP) or self learning pixel corrections (DxO DPP)", said Jerome Meniere, Chairman and CEO of DxO Labs.
Monday, September 20, 2010
Bob Gove Talks about Small Pixel Progress
Inquirer reports from the last week's Future World Symposium in London: Bob Gove, president and CTO of Aptina, said pixel sizes on both CCD and CMOS camera sensors are shrinking roughly in line with Moore's Law, pushing up resolutions.
Changes in pixel microstructure will make them more efficient, enabling them to capture scenes in low light. And, by processing multiple images captured in rapid succession, cameras can capture details of both shadows and highlights in a scene. Speaking after his address, Gove reckoned that by 2014 cameras will be able to match the human eye in its ability to easily capture a scene in virtually any lighting condition.
Changes in pixel microstructure will make them more efficient, enabling them to capture scenes in low light. And, by processing multiple images captured in rapid succession, cameras can capture details of both shadows and highlights in a scene. Speaking after his address, Gove reckoned that by 2014 cameras will be able to match the human eye in its ability to easily capture a scene in virtually any lighting condition.
Thursday, September 16, 2010
Samsung Plans 3D Cameras with Single Sensor
Korea Times quoted Park Sang-jin, president of Samsung’s digital imaging division, saying "As the issue with 3D televisions is providing a glass-free viewer experience, 3D cameras has a similar challenge for achieving a one-lens, one-imaging sensor approach. The two-lens, two-sensor 3D camera released by Fuji is still too expensive and inconvenient for users."
Park also said that the company may produce a camera capable of taking three-dimensional (3D) images sometime next year, but admitted that it will be a digital guinea pig, saying that the "real" 3D cameras that are suited for conventional use won’t probably be available until after 2012.
Park also said that the company may produce a camera capable of taking three-dimensional (3D) images sometime next year, but admitted that it will be a digital guinea pig, saying that the "real" 3D cameras that are suited for conventional use won’t probably be available until after 2012.
Wednesday, September 15, 2010
Technavio Global Image Sensor Market Report
While many different companies published image sensor market reports recently, a title of the most entertaining one goes to "Global Image Sensors Market 2009-2013" published by Technavio, in my opinion anyway. Here are some interesting quotes from the Technavio announcement:
"The major growth drivers include:
- Rising demand for digital cameras, which are increasingly using image sensors"
"Complementary metal-oxide-semiconductor (CMOS) image sensors have not been able to provide great image quality as compared to others like (Charged-Coupled Device) CCD image sensor. Temporary noise problem, where, CMOS image sensors suffer from higher noise due to the additional pixels, is another important deterrent."
Another Technavio PR has a nice definition of the image sensor market:
"For the purpose of this report, the Global Image Sensors market refers to an integrated chip that contains a processor core, memory, programmable input/output ports and timers."
A single-user license costs $1,500 for those willing to pay for it. By the way, Technavio forecasts the image sensors market to grow at a CAGR of 11.8 percent, with APAC region witnessing highest growth rate, according to Business Wire.
"The major growth drivers include:
- Rising demand for digital cameras, which are increasingly using image sensors"
"Complementary metal-oxide-semiconductor (CMOS) image sensors have not been able to provide great image quality as compared to others like (Charged-Coupled Device) CCD image sensor. Temporary noise problem, where, CMOS image sensors suffer from higher noise due to the additional pixels, is another important deterrent."
Another Technavio PR has a nice definition of the image sensor market:
"For the purpose of this report, the Global Image Sensors market refers to an integrated chip that contains a processor core, memory, programmable input/output ports and timers."
A single-user license costs $1,500 for those willing to pay for it. By the way, Technavio forecasts the image sensors market to grow at a CAGR of 11.8 percent, with APAC region witnessing highest growth rate, according to Business Wire.
IC Insights Quantifies CIS Market Growth in 2010
According to IC Insights' fifth-edition 2010 O-S-D Report, CMOS image sensors market is forecast to grow 34% to $5.2B in sales in 2010:
NIT Raises 3M Euros
CMOS image sensor start-up New Imaging Technologies (NIT) has successfully concluded a round of private equity financing from French high-tech investment firms ACE Management, Alto Invest, Emertec Gestion, totaling 3M euros. The new round of investment for NIT is oriented towards the ongoing development of innovative CMOS image sensor technologies and further business expansion. “This substantial capital increase will allow us to implement in time our strategic roadmap of new product introduction and sales development ”, says Pierre Potet President of NIT,
Thanks to A.T. for this info.
Thanks to A.T. for this info.
Samsung Demos BSI Sensors
Business Wire: Samsung announced two new 1.4um CMOS imagers, the 1/4-inch 5MP S5K4E5 and 1/2.33-inch 14.6MP S5K2N1, adopting BSI pixel technology. S5K4E5 is optimized for smartphone applications, while S5K2N1 is targeted to DSCs and digital video cameras (DVC). The imagers have been demonstrated at the seventh annual Samsung Mobile Solutions Forum held in Taiwan om Sept. 7th.
Samsung’s new BSI imagers are said to show 30% enhancement in low light sensitivity over conventional front side illumination imagers of the same pixel size.
The imagers are designed to support full resolution 30fps and 1080/60fps video modes. The S5K4E5 has a wider CRA that reduces the height of the imager package making it attractive for slim, small form factor smartphones with demanding z-height requirements.
The S5K2N1 is said to leverage Samsung’s low-power 90nm logic process technology. Samsung is able to offer a dedicated thermal enhanced plastic lead ceramic carrier (TePLCC) package to more effectively dissipate the heat generated by the high performance device.
Samples of the 5Mp S5K4E5 are available now with mass production starting in the fourth quarter of this year. The 14.6Mp S5K2N1 is expected to start sampling in the Q4 2010 with production scheduled in Q1 2011.
Samsung’s new BSI imagers are said to show 30% enhancement in low light sensitivity over conventional front side illumination imagers of the same pixel size.
The imagers are designed to support full resolution 30fps and 1080/60fps video modes. The S5K4E5 has a wider CRA that reduces the height of the imager package making it attractive for slim, small form factor smartphones with demanding z-height requirements.
The S5K2N1 is said to leverage Samsung’s low-power 90nm logic process technology. Samsung is able to offer a dedicated thermal enhanced plastic lead ceramic carrier (TePLCC) package to more effectively dissipate the heat generated by the high performance device.
Samples of the 5Mp S5K4E5 are available now with mass production starting in the fourth quarter of this year. The 14.6Mp S5K2N1 is expected to start sampling in the Q4 2010 with production scheduled in Q1 2011.
Canon Rumored to Introduce BSI-based DSLR in 2011
EOSHD.com published a rumor that Canon is going to launch a mirrorless DSLR camera based on 22MP BSI sensor. The new BSI sensor is 18mm x 12mm in size (approximately Micro 4/3rds sized, but having 3:2 aspect ratio). The camera has a feature that windows the centre part of the sensor. In this sensor windowing mode, the camera's continuous shooting rate increases to a whopping 20fps and resolution drops to 5.5MP whilst offering a tighter crop of the image
Friday, September 03, 2010
BSI Sensor Shipments to Reach 33.4M This Year, BSI Adoption Driven by iPhone 4
iSuppli: Shipments of BSI sensors for mid- to high-end smart handsets are projected to reach 33.4 million units in 2010, up from virtually nil last year. The market will continue to post sizable increases during the next four years and rise almost tenfold to over 300 million units by 2014, consumer electronics research from iSuppli indicates.
“With Apple tending to shape trends, handset OEMS are likely to follow suit and incorporate enhanced cameras with BSI image sensors,” said Pamela Tufegdzic, analyst for consumer electronics at iSuppli. “BSI sensors will first see utilization in high-end mobile handsets, and then gradually make their way into the camera phones of lower-cost feature handsets as the price of BSI sensors comes down.”
By 2014, approximately 75 percent of mid- to higher-end smart phones will include BSI sensors—a huge leap from the 14 percent projected for the end of this year, she noted.
The startling growth of BSI sensors is completely in line with the robust, double-digit expansion projected this year for the overall area image sensor market as it recovers from the economic downturn and also penetrate new applications. Area image sensor shipments in 2010 will hit 1.7 billion units, up 20 percent from 1.4 billion units in 2009, with revenue during the same period climbing to $6.9 billion, up from $5.9 billion.
The fortunes of CCDs continue to decline, iSuppli’s consumer electronics research shows. By 2014, CCD sensor shipments will be off by nearly half of their levels in 2008, with the market inexorably heading in the direction of CMOS image sensors.
“With Apple tending to shape trends, handset OEMS are likely to follow suit and incorporate enhanced cameras with BSI image sensors,” said Pamela Tufegdzic, analyst for consumer electronics at iSuppli. “BSI sensors will first see utilization in high-end mobile handsets, and then gradually make their way into the camera phones of lower-cost feature handsets as the price of BSI sensors comes down.”
By 2014, approximately 75 percent of mid- to higher-end smart phones will include BSI sensors—a huge leap from the 14 percent projected for the end of this year, she noted.
The startling growth of BSI sensors is completely in line with the robust, double-digit expansion projected this year for the overall area image sensor market as it recovers from the economic downturn and also penetrate new applications. Area image sensor shipments in 2010 will hit 1.7 billion units, up 20 percent from 1.4 billion units in 2009, with revenue during the same period climbing to $6.9 billion, up from $5.9 billion.
The fortunes of CCDs continue to decline, iSuppli’s consumer electronics research shows. By 2014, CCD sensor shipments will be off by nearly half of their levels in 2008, with the market inexorably heading in the direction of CMOS image sensors.
Wednesday, September 01, 2010
Sony to Spend Y40bn to Expand CIS Capacity, BSI Applications Range
NIKKEI, Fox Business: Sony said it will spend about Y40 billion to boost its output capacity for image sensors for digital cameras, as it expects the business to grow due to brisk global demand for camera-equipped smartphones and DSLRs.
The Japanese electronics giant plans to raise the production capacity of CMOS image sensors at its plant in Kumamoto Prefecture, southern Japan, to 22,500 wafers a month by the next fiscal year through March 2012, from the current monthly output capacity of 16,000 wafers.
Update: Business Wire: Now there is an official PR from Sony, saying that the money will be invested over the time from 2H of FY2010 through FY2011. The capacity at Kumamoto Prefecture fab will be increased from 16,000 300mm wafers a month to 22,500 300mm wafers monthly.
Sony is going to increase BSI production capability and expand the BSI sensors applications to smartphones as well as a wide range of digital imaging products for consumer and professional use, including DSLRs.
Since 2009, Sony has been mass producing BSI sensors for DSCs and camcorders on 200mm wafer lines at Sony Semiconductor Kyushu Corporation’s Nagasaki Technology Center. Furthermore, at the end of this year Sony plans to start the mass production of BSI sensors on 300mm wafer lines at Kumamoto TEC for mobile phone and compact DSC markets.
Update #2: The news release at Sony site has some additional information and a picture of Kyushu facility.
The Japanese electronics giant plans to raise the production capacity of CMOS image sensors at its plant in Kumamoto Prefecture, southern Japan, to 22,500 wafers a month by the next fiscal year through March 2012, from the current monthly output capacity of 16,000 wafers.
Update: Business Wire: Now there is an official PR from Sony, saying that the money will be invested over the time from 2H of FY2010 through FY2011. The capacity at Kumamoto Prefecture fab will be increased from 16,000 300mm wafers a month to 22,500 300mm wafers monthly.
Sony is going to increase BSI production capability and expand the BSI sensors applications to smartphones as well as a wide range of digital imaging products for consumer and professional use, including DSLRs.
Since 2009, Sony has been mass producing BSI sensors for DSCs and camcorders on 200mm wafer lines at Sony Semiconductor Kyushu Corporation’s Nagasaki Technology Center. Furthermore, at the end of this year Sony plans to start the mass production of BSI sensors on 300mm wafer lines at Kumamoto TEC for mobile phone and compact DSC markets.
Update #2: The news release at Sony site has some additional information and a picture of Kyushu facility.
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