Caltech publishes Nature paper "Single-shot ultrafast imaging attaining 70 trillion frames per second" by Peng Wang, Jinyang Liang, and Lihong V. Wang.
"Real-time imaging of countless femtosecond dynamics requires extreme speeds orders of magnitude beyond the limits of electronic sensors. Existing femtosecond imaging modalities either require event repetition or provide single-shot acquisition with no more than 1013 frames per second (fps) and 3 × 10^2 frames. Here, we report compressed ultrafast spectral photography (CUSP), which attains several new records in single-shot multi-dimensional imaging speeds. In active mode, CUSP achieves both 7 × 10^13 fps and 103 frames simultaneously by synergizing spectral encoding, pulse splitting, temporal shearing, and compressed sensing—enabling unprecedented quantitative imaging of rapid nonlinear light-matter interaction. In passive mode, CUSP provides four-dimensional (4D) spectral imaging at 0.5 × 10^12 fps, allowing the first single-shot spectrally resolved fluorescence lifetime imaging microscopy (SR-FLIM). As a real-time multi-dimensional imaging technology with the highest speeds and most frames, CUSP is envisioned to play instrumental roles in numerous pivotal scientific studies without the need for event repetition."
Tuesday, May 05, 2020
OmniVision Launches Automotive SoC for Entry-Level Rearview Cameras
PRNewswire: OmniVision announces its 1.3MP OX01E10 SoC for entry-level rearview cameras (RVC). In a single, 1/4" optical format package, the OX01E10 integrates a 3um image sensor and an ISP. Additionally, the OX01E10 provides two onscreen display overlay layers for driver guidelines, as well as distortion correction to straighten any curved edges from lenses with a wide viewing angle.
The OX01E10 features power consumption that is over 35% lower than competitors' and significantly reduces temperature. This is said to be the only imaging device for entry-level RVC that does not require a metal heat sink, allowing for the use of plastic camera module bodies to reduce costs. With its compact package size, it also enables smaller cameras that can fit in much tighter spaces. In addition, by integrating both the image sensor and ISP into a single chip, designers can save on both cost and space by eliminating the second PCB in typical two-chip implementations. OmniVision's dual conversion gain (DCG) technology is employed in this SoC to achieve a HDR of 120dB with two captures.
The OX01E10 SoC is AEC-Q100 Grade 2 certified and samples are available now, with mass production expected in Q3 2020.
The OX01E10 features power consumption that is over 35% lower than competitors' and significantly reduces temperature. This is said to be the only imaging device for entry-level RVC that does not require a metal heat sink, allowing for the use of plastic camera module bodies to reduce costs. With its compact package size, it also enables smaller cameras that can fit in much tighter spaces. In addition, by integrating both the image sensor and ISP into a single chip, designers can save on both cost and space by eliminating the second PCB in typical two-chip implementations. OmniVision's dual conversion gain (DCG) technology is employed in this SoC to achieve a HDR of 120dB with two captures.
The OX01E10 SoC is AEC-Q100 Grade 2 certified and samples are available now, with mass production expected in Q3 2020.
Tower and Technion Integrate Organic PD into CMOS Process
Tower and Technion, Israel Institute of Technology, publish a Nature paper "Hybrid image sensor of small molecule organic photodiode on CMOS – Integration and characterization" by Himanshu Shekhar, Amos Fenigstein, Tomer Leitner, Becky Lavi, Dmitry Veinger, and Nir Tessler.
"Here, we demonstrate seamless integration of a thermally deposited visible light sensitive small molecule OPD on a standard commercial CMOS substrate using optimized doped PCBM buffer layer. Under a standard power supply voltage of 3 V, this hybrid device shows an excellent photolinearity in the entire bias regime, a high pixel sensitivity of 2 V/Lux.sec, a dynamic range (DR) of 71 dB, and a low dark leakage current density of 1 nA/cm2. Moreover, the integrated OPD has a minimum bandwidth of 400 kHz. The photoresponse nonuniformity being only 1.7%, achieved under research lab conditions, strengthens the notion that this fully-CMOS compatible technology has the potential to be applied in high-performance large-scale imaging array."
"Here, we demonstrate seamless integration of a thermally deposited visible light sensitive small molecule OPD on a standard commercial CMOS substrate using optimized doped PCBM buffer layer. Under a standard power supply voltage of 3 V, this hybrid device shows an excellent photolinearity in the entire bias regime, a high pixel sensitivity of 2 V/Lux.sec, a dynamic range (DR) of 71 dB, and a low dark leakage current density of 1 nA/cm2. Moreover, the integrated OPD has a minimum bandwidth of 400 kHz. The photoresponse nonuniformity being only 1.7%, achieved under research lab conditions, strengthens the notion that this fully-CMOS compatible technology has the potential to be applied in high-performance large-scale imaging array."
Monday, May 04, 2020
Lucid Vision Labs Compares 4 Generations of Sony Global Shutter Pixels
Sunday, May 03, 2020
HDR: Where to Go Next?
INSTICC publishes Alan Chalmers' talk "High Dynamic Range: Where to next?" presented at VISIGRAPP in February 2020 at Malta.
Saturday, May 02, 2020
EPFL Presentation on LiDAR Fundamentals
EPFL presentation "LiDAR Fundamentals" by Claudio Bruschini, Preethi Padmanabhan, Edoardo Charbon has been published by SENSE Detector School a year ago.
Friday, May 01, 2020
Trieye First Public SWIR Image
Trieye Board of Directors member Ido Yablonka twits the company's first public SWIR image:
"Delivery >> corona crisis.
a sneak peek at a breakthrough in progress - amazing work by @TriEye_tech #swir #deeptech"
"Delivery >> corona crisis.
a sneak peek at a breakthrough in progress - amazing work by @TriEye_tech #swir #deeptech"
CML Reports that Tier 1 Smartphone Adopts its ToF Technology
Cambridge Mechatronics Ltd. reports: "The LiDAR scanner used by Apple in its recently released iPad Pro uses technology to increase the range to five metres and include more of the surroundings. However, this LiDAR technology results in a compromise to measurement resolution. Some reviewers highlighted performance inaccuracies and limitations.
However, CML has developed technology that increases the range to ten metres without compromising measurement resolution. Tier 1 smartphone supply chains are including this functionality in module samples planned to be available in Q3 this year.
The 3D sensing modules including CML’s technology will have double the working range compared to the LiDAR scanner and ten times superior measurement accuracy. This can deliver the most realistic AR experiences in a broader range of scenarios."
However, CML has developed technology that increases the range to ten metres without compromising measurement resolution. Tier 1 smartphone supply chains are including this functionality in module samples planned to be available in Q3 this year.
The 3D sensing modules including CML’s technology will have double the working range compared to the LiDAR scanner and ten times superior measurement accuracy. This can deliver the most realistic AR experiences in a broader range of scenarios."
nanoLambda Seeks Partnerships and Funding
NanoLambda publishes a Youtube video saying that its spectrometer module has more than 30 competitors now. So, the company looks for partnerships and funding for its technology:
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