IMEC publishes Vimeo video demo of its HSI multispectral camera (which could be compared to 65 000 spectroscope spatially capturing the spectral signature of 32 points):
Recently, IMEC announced that its multispectral imagers are adapted by several camera manufacturers:
"We are excited to announce the successful integration of our first generation hyperspectral image sensor prototypes by several camera vendor companies. These strategic partnerships on different applications highlight the broad potential of this unique optical-filter-on-chip sensor solution," said Rudi Cartuyvels, SVP of smart systems at imec. "Our technology expertise will enable our partners to add new range of products to their offering, effectively opening up new markets in the booming field of imaging spectroscopy."
Thursday, February 13, 2014
Heptagon Unveils Array Camera
Business Wire: Heptagon announces the general availability of its TrueD H2 array camera, the first in a series of advanced 3D imaging and depth sensing micro systems that Heptagon is introducing to the market. The TrueD H2 camera has one of the smallest form factors currently available for mass production, measuring just 5.9mmx5.8mmx2.25mm.
Heptagon’s TrueD H2 array camera captures additional short-range depth information for gesture and user recognition, background removal, and enhanced imaging. Its key features are typically used for front-facing smart device cameras, but can also add value as an assisting camera to the smart device’s primary camera. The TrueD H2 array camera is the result of integration of its image sensor, module, optics, algorithms, and software.
"Smart device innovations continue at warp speed, transforming the ways people interact with their devices. So, our challenge is to deliver micro imaging and sensing systems for these devices with enhanced capabilities, ultra high quality, ever-shrinking form factor and optimal cost," said Rene Kromhof, Heptagon’s VP of sales and marketing. "With the TrueD H2 array camera, we have proven our ability to innovate rapidly and produce high-volume, market-ready solutions that meet customers’ unique and demanding requirements."
In addition to depth mapping, low z-height, and low power consumption, the TrueD H2 array camera features a unique, patented focus correction packaging (FCP) that accelerates low cost, high quality production. FCP enables high-throughput, low cycle time module assembly, without the need for active alignment systems or barrel-mount solutions. In addition to faster line production, FCP also drives higher yield and therefore lower overall unit costs – important benefits for rapid, high volume manufacturing of smart devices.
The TrueD H2 2x2 array camera is the result of more than three years of development efforts from Heptagon. The 2014-15 pipeline will include new array formats, lens enhancements, higher resolution, and additional sensing system innovations.
Heptagon’s TrueD H2 array camera captures additional short-range depth information for gesture and user recognition, background removal, and enhanced imaging. Its key features are typically used for front-facing smart device cameras, but can also add value as an assisting camera to the smart device’s primary camera. The TrueD H2 array camera is the result of integration of its image sensor, module, optics, algorithms, and software.
"Smart device innovations continue at warp speed, transforming the ways people interact with their devices. So, our challenge is to deliver micro imaging and sensing systems for these devices with enhanced capabilities, ultra high quality, ever-shrinking form factor and optimal cost," said Rene Kromhof, Heptagon’s VP of sales and marketing. "With the TrueD H2 array camera, we have proven our ability to innovate rapidly and produce high-volume, market-ready solutions that meet customers’ unique and demanding requirements."
In addition to depth mapping, low z-height, and low power consumption, the TrueD H2 array camera features a unique, patented focus correction packaging (FCP) that accelerates low cost, high quality production. FCP enables high-throughput, low cycle time module assembly, without the need for active alignment systems or barrel-mount solutions. In addition to faster line production, FCP also drives higher yield and therefore lower overall unit costs – important benefits for rapid, high volume manufacturing of smart devices.
The TrueD H2 2x2 array camera is the result of more than three years of development efforts from Heptagon. The 2014-15 pipeline will include new array formats, lens enhancements, higher resolution, and additional sensing system innovations.
Wednesday, February 12, 2014
WLCSP Listed at Shanghai Stock Market at $780M Valuation
PR Newswire: China-based Wafer Level Chip Scale Package (WLCSP) has been listed on the Shanghai Stock Exchange and has raised US$118M with an IPO price of US$780M - not a bad valuation for a company that begun as an image sensor packaging house. The company started in 2005, when essentially all Shellcase manufacturing business was moved to China. Shellcase R&D team was sold to Tessera for $33M in 2006, while WLCSP manufacturing in China grew into a large business, although still remaining in 8-inch wafer realm:
Nikkei: Sony to Supply iPhone Front Camera Sensors
Nikkei article says that "Apple is likely looking to switch to Sony sensors for the secondary camera on the screen side, used for taking self-portraits." Up to now, most of the front sensors for iPhone were sourced from Omnivision. So far Sony only supplied high resolution rear sensor to Apple. If the report is true, then either Apple is going to switch its front sensor to higher resolution, like some Chinese smartphone vendors, or Sony is moving to capture some of the lower end sensor market. The former might be more probable, as Nikkei says that Apple asked Sony to double image sensor production.
Nikkei claims that "A request from Apple [to increase CMOS sensors supply] was the reason for its January decision to purchase a plant from Japanese chipmaker Renesas Electronics, according to a source involved in the negotiations." "Sony is a supplier for Samsung Electronics, the world's top smartphone seller, and No. 3 Huawei Technologies, as well as Apple." "Sony's image sensor sales, chiefly CMOS sensors, are expected to total about 360 billion yen ($3.47 billion) this fiscal year. It held the largest share of the global CMOS sensor market in 2012 at 32.1%, according to Techno Systems Research."
Nikkei claims that "A request from Apple [to increase CMOS sensors supply] was the reason for its January decision to purchase a plant from Japanese chipmaker Renesas Electronics, according to a source involved in the negotiations." "Sony is a supplier for Samsung Electronics, the world's top smartphone seller, and No. 3 Huawei Technologies, as well as Apple." "Sony's image sensor sales, chiefly CMOS sensors, are expected to total about 360 billion yen ($3.47 billion) this fiscal year. It held the largest share of the global CMOS sensor market in 2012 at 32.1%, according to Techno Systems Research."
Tuesday, February 11, 2014
Invisage Starts Pre-Release Public Campaign
Invisage apparently prepares the public to a release of its first product later this year. Invisage CTO and Founder, Ted Sargent, posts in the company blog:
"InVisage’s QuantumFilm offers consistently maximal fill factors for all pixel sizes—today’s leading-edge 1.1 um pixels. QuantumFilm enables 100% fill factor by virtue of its being continuous. The entire area of the imaging array is occupied by a medium whose sole purpose is light sensing. At the same time, 100% of each pixel is also available to the silicon beneath for rendering beautiful color images."
"New features enabled by InVisage’s advance include ultra-high sensitive, ultra-wide dynamic range, and ultra-high resolution imaging. New capabilities include the first shutter capability built into the image sensor itself, and reach into the spectral regimes invisible to silicon."
"InVisage’s QuantumFilm offers consistently maximal fill factors for all pixel sizes—today’s leading-edge 1.1 um pixels. QuantumFilm enables 100% fill factor by virtue of its being continuous. The entire area of the imaging array is occupied by a medium whose sole purpose is light sensing. At the same time, 100% of each pixel is also available to the silicon beneath for rendering beautiful color images."
"New features enabled by InVisage’s advance include ultra-high sensitive, ultra-wide dynamic range, and ultra-high resolution imaging. New capabilities include the first shutter capability built into the image sensor itself, and reach into the spectral regimes invisible to silicon."
Monday, February 10, 2014
Sigma Announces Quattro Foveon Sensor
Sigma announces "Foveon X3 Quattro direct image sensor" with top blue sensing layer split into four pixels, on top of the single green and read pixels:
The new split-blue approach is said to increase the sonsor's resolution by 30% to be equivalent of that of 39MP Bayer sensor.
 |
| The new 1:1:4 structure (bottom 1: middle 1: top 4) offers higher resolution that is equivalent to 39 megapixels for conventional color filter array sensors. In addition to the higher resolution, the sensor offers enhanced noise characteristics and faster processing and writing to memory of high-volume image data. |
The new split-blue approach is said to increase the sonsor's resolution by 30% to be equivalent of that of 39MP Bayer sensor.
Sunday, February 09, 2014
BDTI Analyses Imagination's Raptor ISP
BDTI publishes an article on Imagination Technology's Raptor ISP IP, announced in Nov. 2013. Imagination got into ISP technology with Nethra acquisition in June 2012. The company claims a number of advantages of moving the ISP functionality from image sensor to an application processor:
- No functional constraints that might be caused by the image sensor's or standalone chip's comparatively conservative manufacturing process
- Higher performance due to the application processor's same process advantages
- Access to main system memory for enhanced functionality, and
- Reduced cost and increased flexibility in image sensor choice
Saturday, February 08, 2014
Aptina Publishes Solutions Brochures
Aptina publishes brochures presenting its solutions for mobile, medical, and surveillance markets.
The mobile brochure promotes Clarity+ technology:
Medical brochure emphasizes high color accuracy and low noise:
The mobile brochure promotes Clarity+ technology:
Medical brochure emphasizes high color accuracy and low noise:
SoftKinetic Voted "Best Overall" by Investor Panel
Integrated Systems Europe 2014 exhibition has held an investor panel selecting the best startup companies. SoftKinetic was voted "Best Overall" by the panel. The investor jury included 360 Capital, Atlantic Bridge (AbVen), Beringea, Robert Bosch Venture Capital, Intel Capital, Prime Ventures, Qualcomm Ventures, Swisscom Ventures and Wellington Partners.
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