On Semi announces the completion of its acquisition of Truesense Imaging. ON Semi paid approximately $95M in cash off its balance sheet, after adjustments for cash and working capital amounts, to purchase Truesense Imaging. Based on audited results, Truesense Imaging’s revenue for 2013 was approximately $79 million with gross and operating margins of approximately 44% and 23%, respectively.
Chris McNiffe, CEO and president of Truesense, has been retained by the ON Semiconductor team to help manage and grow our image sensor business. The Truesense product development and business teams will be incorporated in ON Semi’s Application Products Group (APG) as part of the company’s Image Sensor Business Unit, reporting to Vince Hopkin, VP of ON Semiconductor’s MDFI Division. The Truesense’s factory operations will report up through ON Semiconductor’s corporate manufacturing organization.
The former Truesense Imaging owner, Platinum Equity too announces the completion of the deal. "We are proud of this investment and of all the hard work that went into making it successful," said Platinum Equity’s Jason Leach, who led the initial Truesense acquisition from Kodak. "The business is fundamentally strong and is well positioned to succeed under new ownership."
Friday, May 02, 2014
Thursday, May 01, 2014
Mobile Photography Future
Embedded.com publishes an article "Mobile photography's developing image" by Michael McDonald, saying that resolution is not a differentiation factor anymore. Instead, the future camera phones will have computational photography features, such as HDR, super-resolution, 3D, imaging and more.
Wednesday, April 30, 2014
ESPROS ToF Camera Demo
Polytec, ESPROS Photonics' distributor of ToF cameras, has published a Youtube video showing the epc6xx 8x8 pixel camera in action:
Tuesday, April 29, 2014
Teledyne DALSA Presents Fast X-Ray Imagers
Marketwired: Teledyne DALSA introduces the first in its new Rad-icon series of CMOS X-Ray cameras. The Rad-icon 1520 detector features 1548 x 2064 pixel resolution, an active area of 15.3 x 20.4 cm, and 99um pixel size and delivers real-time frame rates of up to 30 fps. "The Rad-icon digital x-ray cameras deliver a unique combination of speed, resolution and connectivity," commented Thorsten Achterkirchen, VP X-Ray Imaging for Teledyne DALSA. "The 1520 is only the beginning of what we are promoting as a cost-effective and flexible platform for high performance digital x-ray imaging for non-destructive testing."
Dual Aperture Announces its Camera Module Manufacturer
PR Newswire: Dual Aperture keeps announcing its partners. Recently, it has announced its image sensor partner (Hynix/SiliconFile) and DSP partner (eWBM). Now the company says that it cooperates with Ability Enterprise on camera design. Ability Enterprise and Dual Aperture partner together on a technology licensing agreement whereby Ability Enterprise will incorporate Dual Aperture's 4-color sensor technology, image processing algorithms and various application software, into their latest line of camera module products.
Dual Aperture's technology utilizes a proprietary 4-color sensor design comprised of RGB and IR pixels. Built with separate apertures for the RGB and IR pixels, the sensor is able to generate two distinct images, one in the RGB spectrum and the other in the IR, with a single capture. This allows to estimate a depth of the image, as explained in a Youtube video:
Dual Aperture's technology utilizes a proprietary 4-color sensor design comprised of RGB and IR pixels. Built with separate apertures for the RGB and IR pixels, the sensor is able to generate two distinct images, one in the RGB spectrum and the other in the IR, with a single capture. This allows to estimate a depth of the image, as explained in a Youtube video:
Monday, April 28, 2014
Canesta Veterans Unveil a New Gesture Recognition Company
EETimes, Venture Beat: Aquifi, founded by a few ex-Canesta engineers, announce Fluid Experience - software only gesture recognition based on a regular HD-resolution webcam, machine learning algorithms and cloud services. The cloud part accumulates the different users experience with the gesture tracking and processes it to improve the accuracy over time.
"If Kinect was the first generation, we’re building the second generation," said Nazim Kareemi, Aquifi CEO. "In the past, you had to adapt to the machine. We want it to adapt to you." The Palo Alto, Calif.-based Aquifi has raised $9M from Benchmark Capital, and private investors including Mike Farmwald, cofounder of Rambus. Aquifi was founded in 2011, and it has 29 employees. A Youtube video presents the company and its technology:
"If Kinect was the first generation, we’re building the second generation," said Nazim Kareemi, Aquifi CEO. "In the past, you had to adapt to the machine. We want it to adapt to you." The Palo Alto, Calif.-based Aquifi has raised $9M from Benchmark Capital, and private investors including Mike Farmwald, cofounder of Rambus. Aquifi was founded in 2011, and it has 29 employees. A Youtube video presents the company and its technology:
Saturday, April 26, 2014
EETimes on Image Sensor Applications
EETimes publishes a popular article "Sensors Beyond Megapixels" by Junko Yoshida on image sensor applications beyond the mainstream consumer ones. No revelations there, the article just briefly talks about automotive, food sorting, dental, and few other applications.
Friday, April 25, 2014
Panasonic to Discontinue ToF D-Imager
Panasonic announces that its ToF Image Sensor D-IMager will be discontinued at the end of December 2014. Thanks to MR for the link!
More on Sony Curved Sensor Paper
VLSI Symposia tipsheet publishes a re-phrased version of Sony curved image sensor paper abstract accompanied by a figure:
"Curved CMOS Image System: When light transmitted by a lens strikes a perpendicular target such as a CMOS image sensor, it forms a circle of light called an image circle. It’s difficult for a flat (planar) CMOS image sensor to deliver high image sensitivity at high resolution (highly scaled pixel pitch) because of the fundamental physical limit known as quantum efficiency. To break through that physical limit and to achieve higher sensitivity anywhere within the image circle at higher resolution, Sony built and will describe an imaging system that comprises a hemispherically curved, back-illuminated CMOS image sensor (BIS) and integrated lens. It doubles the sensitivity at the edge of the image circle while increasing sensitivity at its center by a factor of 1.4, with a 5x reduction of dark current (Jd) compared to a planar BIS. Moreover, a common problem known as lens field curvature aberration (Afc) is mitigated by the curved sensor itself, and so the curved BIS enables higher system sensitivity with a brighter lens with a smaller F number (Fn) than is possible with a planar BIS. In addition, by controlling the tensile stress of the BIS chip to produce a curved shape in the first place, the energy band-gap (Eg) is widened and a lower Jd is achieved. (Paper T2.1, “A Novel Curved CMOS Image Sensor Integrated with Imaging System,” K. Itonaga et al., Sony)"
"Curved CMOS Image System: When light transmitted by a lens strikes a perpendicular target such as a CMOS image sensor, it forms a circle of light called an image circle. It’s difficult for a flat (planar) CMOS image sensor to deliver high image sensitivity at high resolution (highly scaled pixel pitch) because of the fundamental physical limit known as quantum efficiency. To break through that physical limit and to achieve higher sensitivity anywhere within the image circle at higher resolution, Sony built and will describe an imaging system that comprises a hemispherically curved, back-illuminated CMOS image sensor (BIS) and integrated lens. It doubles the sensitivity at the edge of the image circle while increasing sensitivity at its center by a factor of 1.4, with a 5x reduction of dark current (Jd) compared to a planar BIS. Moreover, a common problem known as lens field curvature aberration (Afc) is mitigated by the curved sensor itself, and so the curved BIS enables higher system sensitivity with a brighter lens with a smaller F number (Fn) than is possible with a planar BIS. In addition, by controlling the tensile stress of the BIS chip to produce a curved shape in the first place, the energy band-gap (Eg) is widened and a lower Jd is achieved. (Paper T2.1, “A Novel Curved CMOS Image Sensor Integrated with Imaging System,” K. Itonaga et al., Sony)"
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| Concept of an imaging system which integrates a curved sensor with a brighter (lower F number) lens for better image sensitivity. |
Thursday, April 24, 2014
Sony Presents 2nd Generation 13MP Stacked Sensor for Smartphones
Sony presents 13MP IMX214 sensor, already featuring in Oppo Find 7 and OnePlus One smartphones. The 1/4-inch 1.12um pixel IMX214 is said to be "the industry's first 13M-Pixel CMOS image sensor enabling HDR output at 30 frame/s." The new sensor utilizes SME-HDR (Spatially Multiplexed Exposure HDR) technology. It sets two different exposures in a single frame and performs image processing to generate HDR images. A reduced backside optical stack helps to improve the color crosstalk and angular sensitivity over the 1st generation stacked sensor IMX135:
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