Tuesday, April 21, 2015

Yole on Image Sensor Future

Yole Developpement's recent presentation "More than Moore market and technology trends" forecasts the future of image sensor industry:

Stacked BSI = wafers connected by TSV
Hybryd BSI = stacked sensor with Cu-Cu hybrid bonding

No comments:

Post a Comment

All comments are moderated to avoid spam and personal attacks.