The logic die photo reveals a lot of empty space in the middle of the die:
Tuesday, July 07, 2015
Sony 13MP HDR Stacked Sensor Analysis
Chipworks publishes a series of reverse engineering reports on Sony IMX214 stacked sensor based on 1.12um pixel. The device is defined as "a second generation13 MP Exmor RS “stacked” CIS with spatially multiplexed exposure-high dynamic range (SME-HDR). SME-HDR technology involves imaging at two different exposure conditions and performing image processing to generate images with wide dynamic range."
The logic die photo reveals a lot of empty space in the middle of the die:
The logic die photo reveals a lot of empty space in the middle of the die:
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No, I don't think the center area is empty; it is filled with digital circuits surrounded by many smaller rectangular memory blocks. It's just not shown clearly in this photo, since you didn't pay for it :-)
ReplyDeleteCould be. In that case, I'd expect to see some structures, supply grids, major buses, logic density variations, or something else that reveals the digital architecture. There is nothing like that there.
DeleteI am assuming this would be the image sensor for the next iphone in September.
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