“3D scanning with semiconductors from Infineon helps to interconnect the real and virtual worlds,” said Martin Gotschlich, Director, 3D Imaging at Infineon Technologies. “Mobile devices with an integrated 3D image sensor have spatial awareness of their surroundings and the capability for augmented reality applications with an impressive realistic quality. They pave the way for numerous applications and innovations that were not previously possible.”
Scandy publishes a use case example for the new Asus smartphone:
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