DeviceSpecifications quotes Korean site ETNews saying that Hynix group assembly house JSCK works with Apple on the next generation 3D sensing camera:
"Apple has revealed the iPhone of 2019 will have a triple rear camera setup with 3D sensing capability that will be a step ahead of the technology that was used for the front-facing camera of the iPhone X released in 2017. The front camera will be used for unlocking purposes, and the rear ones will be used to provide augmented reality (AR) experience. According to industry sources, Jesset Taunch Chippak Korea (JSCK), a Korean company in China, has been developing the 3D sensing module since the beginning of this year. It will be placed in the middle of the rear triple camera module... Apple used infrared (IR) as a light source for the iPhone's front-facing camera 3D sensing, but the rear camera plans to use a different light source than the IR because it needs to sense a wider range."
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