Thursday, November 19, 2009

Raytheon Licenses Ziptronix 3D Interconnect Technology

Military and Aerospace Electronics: Raytheon Vision Systems is licensing the Ziptronix direct bond interconnect (DBI) technology in focal plane array technology for air, space and terrestrial image sensor applications. Ziptronix DBI technology provides 3D integration of multilayer CMOS structures within the focal plane.

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