Friday, September 09, 2011


New Imaging Technologies starts sampling its NSC1101, the HDR Read Out IC (ROIC). The NSC1101 is designed to interface with photodiode array through flip chip bonding. NSC1101 is of VGA format (640x512 pixels), it has a pitch of 15um and can accept any PDA with p-on-n or n-on-p. Due to its Native Wide Dynamic Range of more than 120 dB the sensor does not require any setting or exposure time control. NSC1101 can be used with all infrared sensing materials such as InSb, InGaAs or HgCdTe and can operate at cryogenic temperature of 80K. Other photo sensing materials such as AsGa for THz or XRay detection have been already sucessfully used.

NSC1101 is a sampling stage and can be ordered from NIT in a 8" wafer form.

Image from NSC1101 coupled to an InGaAs photodiode array
Shown without uniformity corrections.

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