Sunday, October 05, 2014

TSMC Files Pixel-Level Interconnect in Stacked Sensors Application

TSMC patent application US20140264508 "Structure and Method for 3D Image Sensor" by Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai, Jeng-Shyan Lin, Shu-Ting Tsai, and Wen-I Hsu describes pixel-level interconnect in stacked sensors (BDCT=backside deep contact, BSSI=backside silicon):

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