Sunday, November 08, 2015
TSMC Too Develops Pixels with DTI and Buried CF
TSMC patent application US20150311248 "Back side illuminated image sensor with deep trench isolation structures and self-aligned color filters" by Kuo-cheng Lee, Yun-wei Cheng, Yung-lung Hsu, and Hsin-chi Chen proposes its own way to manufacture pixels with DTI and buried CFA:
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