Friday, February 17, 2017

DALSA Works on DBI-Stacked Sensors

BusinessWire: Invensas, a wholly owned subsidiary of Tessera, announces that Teledyne DALSA has signed a technology transfer and license agreement for Direct Bond Interconnect (DBI) technology.

DBI technology is a key enabler for true 3D-integrated MEMS and image sensor solutions,” said Edwin Roks, president of Teledyne DALSA. “We are excited about the prospect of developing new products and providing new foundry services to our customers that utilize this technology. By working closely with Invensas, we will be able to move more quickly to deploy this capability efficiently and effectively.

We are pleased that Teledyne DALSA, a recognized leader in digital imaging products and MEMS solutions, has chosen our DBI technology to accelerate the development and commercialization of their next generation MEMS and image sensor products,” said Craig Mitchell, President of Invensas.

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