Tuesday, July 08, 2014

Kunshan HuaTian Technologies Invests in 300mm WLP

Business Wire: Kunshan, China-based HuaTian Technologies Ltd., also known as Q-Tech, is exapnding its WLP facility and purchasing SPTS (soon to become Orbotech) Sigma fxP PVD system to deposit under bump metallization (UBM) for its 300mm Flip Chip line and interconnects for their CMOS sensor packages. The company is well known for its cost-effective image sensor wafer level packaging and its wafer level optics. The company's milestones and customer list are quite impressive:

No comments:

Post a Comment

All comments are moderated to avoid spam and personal attacks.