Friday, July 23, 2021
ST Presentation on Pixel-Level Stacking
ST presentation "Challenges and capabilities of 3D integration in CMOS imaging sensors" by Dominique Thomas, Jean Michailos, Krysten Rochereau, Joris Jourdon, and Sandrine Lhostis presents the company's achievements up to September 2019:
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Excellent that we have such a technology in EU
ReplyDeleteThanks this is great information!
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