Wednesday, March 06, 2019

Melexis Announces ToF Sensor That Uses Sony BSI Process

Melexis announces MLX75027, the industry’s first single-chip automotive grade VGA ToF image sensor for applications such as in-car and exterior monitoring.

Apparently, the MLX75027 sensor stacks Sony Back Illuminated pixel array manufactured in 90nm process on top of Melexis-designed SOC. “This is the next and perhaps most significant release in our product portfolio targeting automotive applications using ToF technology,” commented Gualtiero Bagnuoli, Marketing Manager Optical Sensors. “Not only does it reinforce Melexis’ leadership in this space, it provides Tier 1 and Tier 2 manufacturers with a single-chip solution that really could help revolutionise the automotive industry.

Sampling of the MLX75027 will start in July 2019.

Some of the key features of the new sensor:
  • 1/2" optical format
  • VGA (640 x 480) pixel array
  • 10 x 10 µm DepthSense pixels
  • Integrated microlenses
  • Backside illumination (BSI) technology
  • External QE 44.3% (850nm)
  • External QE 25.5% (940nm)
  • High distance accuracy due to programmable modulating frequencies up to 100 MHz
  • AC Demodulation contrast >85 % (50 MHz)
  • AC Demodulation contrast >69 % (100 MHz)
  • Differential light source control with phase delay feedback loop
  • Full resolution distance framerate of max. 135 FPS (4 phases, Tint 300µs, 4-lane data @960mbps MIPI configuration)
  • 1.5ms phase readout time
  • Up to 8 raw phases (or quads) per frame
  • Per-phase statistics & diagnostics
  • Continuous or triggered operation mode(s)
  • CSI-2 serial data output, MIPI D-PHY, 1 clock lane, 2 or 4 data lanes (< 960 Mbps/lane)
  • Built-in temperature sensor
  • ROI selection
  • Support for binning (2x2, 4x4, 8x8)
  • Ambient operating temperature range of -40 - 105°C
  • AEC-Q100 qualified (grade 2)


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