Thursday, June 11, 2009

ST TSV for CIS Process Presented

Semiconductor International reviews TSV papers from 2009 ECTC (Electronic Components and Technology Conference).

In one of the papers CEA Leti , Brewer Science and EVG present the use of a temporary thinning carrier in the ST Micro TSV image sensor product. The product relies on 70um-sized TSVs in 70um-thinned wafer, so vias aspect ratio is 1:1.

No comments:

Post a Comment

All comments are moderated to avoid spam and personal attacks.