SystemPlus publishes a reverse engineering report "3D Time-of-Flight Module in Meizu 17 Pro."
"The 3D sensing module is packaged in one metal enclosure and includes a new Back-side Illumination (BSI) NIR CMOS Image Sensor (CIS) from Samsung. The sensor features 7 µm pixels and a resolution of 0.3 Mpixels. The ToF uses a vertical cavity surface emitting laser (VCSEL) coming from Lumentum.
A wafer level chip scale packaging (WLCSP) driver integrated circuit from PhotonIC generates the pulse and drives the VCSEL’s power and beam shape."
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