“Demand for ultra-small, high-resolution image sensors are growing as smartphones evolve to deliver new and more exciting camera experiences for users,” said Ben K. Hur, VP of System LSI marketing at Samsung Electronics. “With the introduction of our cutting-edge 0.8μm-pixel Samsung ISOCELL Bright GM1 and GD1 image sensors, we are committed to continue driving innovation in image sensor technologies.”
The GM1 and the GD1 sensors are based on the company’s latest pixel isolation technology ISOCELL Plus. In addition, Tetracell technology, where four pixels are merged to work as one to increase light sensitivity, the GM1 and GD1 can deliver light sensitivity equivalent to that of a 1.6μm-pixel image sensor at 12MP and 8MP resolution, respectively. The sensors also support Gyro-based electronic EIS for fast and accurate image capture. A real-time HDR feature is added to the GD1.
The Samsung ISOCELL Bright GM1 and GD1 are expected to be in mass production in Q4 this year.
imaging area is much bigger than chip size!
ReplyDeleteHow do you conclude that? I measure 4:3 aspect ratio from the product images, thus 8000 x 6000 pixels for the 48 Mp version. Multiply by 0,8 micron and we get 6,4mm x 4,8mm imaging area. I have not found the module size, have you?
DeleteWith this package with very long bonding wires, the parasitic inductances will be very high and then low speed can be used. I hope that this is only a prototype and not the final product.
ReplyDeleteOf course it's a prototype. It would be in a completely different package when it goes into smartphones.
DeleteCould anyone give some photo sample with parasitic inductances. I would love to learn what is the final impact.
ReplyDeleteThank you in advance.