Thursday, October 01, 2020

Hybrid Bonding Review

TechInsights publishes a subscribers-only review of hybrid bonding progress: 

 "Hybrid bonding went into volume production after Sony licensed the Zibond technology from Ziptronix (now part of Xperi) and introduced it almost five years ago into their CMOS image sensors (CIS) that use stacked sensor and image processors. Zibond was initially a wafer/wafer bonding technique focused on oxide/oxide interfaces, but it evolved to include copper/copper direct bonds, and Xperi rebranded it as Direct Bond Interconnect (DBI).

Not all companies use Xperi’s licensed technology, so the industry term for face/face wafer bonding with copper/copper interconnect has become “hybrid bonding” (HB). Now almost all of the stacked CIS manufacturers or their foundries have HB available. In the meantime, the process has evolved to give bonding pitches of >4 µm and pad diameters >2 µm."

An example cross section of Sony IMX260 stacked sensor:


  1. similar topic: Besi published a paper at ECTC conference about chip to wafer hybrid bonding machine: paper also available at

  2. Albert Theuwissen - Harvest ImagingOctober 1, 2020 at 9:42 PM

    The alignment between the two wafers is INCREDIBLE ! To me this is a technical miracle !

    1. Hi Albert, this is chip to wafer bonding at 2000 (they even write of 3000) dies/h, so you can bond good dies only for example. at <200nm 3sigma placement accuracy.

    2. Are you sure this is chip-to-wafer and not wafer-to-wafer bonding ? I think it is wafer-to-wafer bonding.

    3. Hi Albert, the machine described in the Besi paper is chip to wafer. Techinsights review might mostly be about wafer to wafer based stacking. And, yes I'm sure, btw the camera system is also a little bit based on your training many years back, thanks for that ;-)

    4. I have heard this was a recomposited wafer, so still wafer to wafer bonding.
      The single demonstration of C2W or C2C know to me has been performed by CEA-LETI on the SET machine...

  3. Besi announced today a collaboration with AMAT for die based hybrid bonding:


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