Thursday, February 12, 2015

Yole on 3D Hybrid Pixels

EETimes publishes an interview with Pierre Cambou, one of the authors of Yole's recent report on CMOS sensor market. Yole predicts that the next trend will likely be 3-D Hybrid CMOS image sensors that by-pass the TSVs for high precision direct copper-to-copper wafer bonding, allowing per-pixel interconnects between the wafers:

Another interesting point is that Yole seems to be too conservative estimating the image sensor market growth in its reports:

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