Thursday, December 24, 2020

ADI Unveils 1MP 3.5um Pixel BSI ToF Sensor

Analog Devices unveils what appears to be the first fruit of cooperation with Microsoft ToF group (former Canesta). The ADSD3100 sensor targets smartphones, AR/VR systems, and machine vision applications in logistics, inventory, industrial, and consumer fields.

The new sensor features:

  • 1024 (horizonal) × 1024 (vertical) pixel array
  • 3.5 μm × 3.5 μm square pixels
  • 1/3.6 inch optical format
  • BSI
  • Depth and intensity imaging
  • 4-wire SPI or 2-wire I2C serial interface
  • Die size: 5.364 mm × 9.799 mm
  • MIPI CSI-2 Tx interface with support for 1, 2, or 4 data lanes, programmable up to 1.5 Gbps per lane
  • Dual, 3.3 V and 1.27 V external supplies, 1.8 V I/O section

For comparison, below are the figures from Microsoft ISSCC 2018 presentation:

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