Thursday, January 06, 2022

8-inch CIS TSV Fab in China Gets 100M RMB Investment

Sohu: Suzhou Keyang Semiconductor Co., Ltd. (Keyang Semiconductor) receives a strategic investment of more than 100M yuan. After the completion of this round of investment, Keyang Semiconductor will accelerate the upgrade of the CIS production line.

Li Yongzhi, Director and CEO of Keyun Semiconductor, says: "In the face of new opportunities, Keyang Semiconductor will continue to dig deeper in the field of advanced semiconductor packaging, and is committed to becoming the world's leading through-silicon via (TSV) and wafer-level packaging (WLP) solution provider!"

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